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Electronic component partname: TESVSP0G475M8R TESVSP0G475M8R description: Resign molded chip ultra miniaturized Manufacturer: NEC Electronics Inc. Temperature range: Min: - | Max: - Chip package & pins: P CASE (Pins: N/A) Datasheet file format: PDF (Requires Adobe Acrobat Reader) TESVSP0G475M8R datasheet size: 124Kb Download TESVSP0G475M8R datasheet: TESVSP0G475M8R |