DS90C031
LVDS Quad CMOS Differential Line Driver
General Description
The DS90C031 is a quad CMOS differential line driver de-
signed for applications requiring ultra low power dissipation
and high data rates. The device is designed to support data
rates in excess of 155.5 Mbps (77.7 MHz) utilizing Low Volt-
age Differential Signaling (LVDS) technology.
The DS90C031 accepts TTL/CMOS input levels and trans-
lates them to low voltage (350 mV) differential output sig-
nals. In addition the driver supports a TRI-STATE
®
function
that may be used to disable the output stage, disabling the
load current, and thus dropping the device to an ultra low idle
power state of 11 mW typical.
The DS90C031 and companion line receiver (DS90C032)
provide a new alternative to high power psuedo-ECL devices
for high speed point-to-point interface applications.
Features
n
>
155.5 Mbps (77.7 MHz) switching rates
n
±
350 mV differential signaling
n
Ultra low power dissipation
n
400 ps maximum differential skew (5V, 25˚C)
n
3.5 ns maximum propagation delay
n
Industrial operating temperature range
n
Military operating temperature range option
n
Available in surface mount packaging (SOIC) and (LCC)
n
Pin compatible with DS26C31, MB571 (PECL) and
41LG (PECL)
n
Compatible with IEEE 1596.3 SCI LVDS standard
n
Conforms to ANSI/TIA/EIA-644 LVDS standard
n
Available to Standard Microcircuit Drawing (SMD)
5962-95833
Connection Diagrams
TRI-STATE
®
is a registered trademark of National Semiconductor Corporation.
Dual-In-Line
DS011946-1
Order Number DS90C031TM
See NS Package Number M16A
LCC Package
DS011946-33
Order Number DS90C031E-QML
See NS Package Number E20A
For Complete Military Specifications,
refer to appropriate SMD or MDS.
June 1998
DS90C031
L
VDS
Quad
CMOS
Differential
Line
Driver
© 1998 National Semiconductor Corporation
DS011946
www.national.com
Functional Diagram
Truth Table
DRIVER
Enables
Input
Outputs
EN
EN*
D
IN
D
OUT+
D
OUT−
L
H
X
Z
Z
All other combinations
L
L
H
of ENABLE inputs
H
H
L
DS011946-2
www.national.com
2
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
)
−0.3V to +6V
Input Voltage (D
IN
)
−0.3V to (V
CC
+ 0.3V)
Enable Input Voltage (EN, EN*)
−0.3V to (V
CC
+ 0.3V)
Output Voltage (D
OUT+
, D
OUT−
)
−0.3V to (V
CC
+ 0.3V)
Short Circuit Duration
(D
OUT+
, D
OUT−
)
Continuous
Maximum Package Power Dissipation
@
+25˚C
M Package
1068 mW
E Package
1900 mW
Derate M Package
8.5 mW/˚C above +25˚C
Derate E Package
12.8 mW/˚C above +25˚C
Storage Temperature Range
−65˚C to +150˚C
Lead Temperature Range
Soldering (4 sec.)
+260˚C
Maximum Junction Temperature
(DS90C031T)
+150˚C
Maximum Junction Temperature
(DS90C031E)
+175˚C
ESD Rating (Note 7)
(HBM, 1.5 k
Ω
, 100 pF)
≥
3,500V
(EIAJ, 0
Ω
, 200 pF)
≥
250V
Recommended Operating
Conditions
Min
Typ
Max
Units
Supply Voltage (V
CC
)
+4.5
+5.0
+5.5
V
Operating Free Air Temperature (T
A
)
DS90C031T
−40
+25
+85
˚C
DS90C031E
−55
+25
+125
˚C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3)
Symbol
Parameter
Conditions
Pin
Min
Typ
Max
Units
V
OD1
Differential Output Voltage
R
L
= 100
Ω
(
Figure 1)
D
OUT−
,
D
OUT+
250
345
450
mV
∆
V
OD1
Change in Magnitude of V
OD1
for Complementary Output
States
4
35
|mV|
V
OS
Offset Voltage
1.125
1.25
1.375
V
∆
V
OS
Change in Magnitude of V
OS
for
Complementary Output States
5
25
|mV|
V
OH
Output Voltage High
R
L
= 100
Ω
1.41
1.60
V
V
OL
Output Voltage Low
0.90
1.07
V
V
IH
Input Voltage High
D
IN
,
EN,
EN*
2.0
V
CC
V
V
IL
Input Voltage Low
GND
0.8
V
I
I
Input Current
V
IN
= V
CC
, GND, 2.5V or 0.4V
−10
±
1
+10
µA
V
CL
Input Clamp Voltage
I
CL
= −18 mA
−1.5
−0.8
V
I
OS
Output Short Circuit Current
V
OUT
= 0V (Note 8)
D
OUT−
,
D
OUT+
−3.5
−5.0
mA
I
OZ
Output TRI-STATE Current
EN = 0.8V and EN* = 2.0V,
V
OUT
= 0V or V
CC
−10
±
1
+10
µA
I
CC
No Load Supply Current
Drivers Enabled
D
IN
= V
CC
or GND
DS90C031T
V
CC
1.7
3.0
mA
D
IN
= 2.5V or 0.4V
4.0
6.5
mA
I
CCL
Loaded Supply Current
Drivers Enabled
R
L
= 100
Ω
All Channels
V
IN
= V
CC
or GND
(all inputs)
DS90C031T
15.4
21.0
mA
DS90C031E
15.4
25.0
mA
I
CCZ
No Load Supply Current
Drivers Disabled
D
IN
= V
CC
or GND
EN = GND, EN* = V
CC
DS90C031T
2.2
4.0
mA
DS90C031E
2.2
10.0
mA
Switching Characteristics
V
CC
= +5.0V, T
A
= +25˚C DS90C031T. (Notes 3, 4, 6, 9)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
t
PHLD
Differential Propagation Delay High to Low
R
L
= 100
Ω
, C
L
= 5 pF
(
Figure 2 and Figure 3)
1.0
2.0
3.0
ns
t
PLHD
Differential Propagation Delay Low to High
1.0
2.1
3.0
ns
t
SKD
Differential Skew |t
PHLD
– t
PLHD
|
0
80
400
ps
t
SK1
Channel-to-Channel Skew (Note 4)
0
300
600
ps
www.national.com
3
Switching Characteristics
(Continued)
V
CC
= +5.0V, T
A
= +25˚C DS90C031T. (Notes 3, 4, 6, 9)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
t
TLH
Rise Time
0.35
1.5
ns
t
THL
Fall Time
0.35
1.5
ns
t
PHZ
Disable Time High to Z
R
L
= 100
Ω
,
C
L
= 5 pF
(
Figure 4 and Figure 5)
2.5
10
ns
t
PLZ
Disable Time Low to Z
2.5
10
ns
t
PZH
Enable Time Z to High
2.5
10
ns
t
PZL
Enable Time Z to Low
2.5
10
ns
Switching Characteristics
V
CC
= +5.0V
±
10%, T
A
= −40˚C to +85˚C DS90C031T. (Notes 3, 4, 5, 6, 9)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
t
PHLD
Differential Propagation Delay High to Low
R
L
= 100
Ω
, C
L
= 5 pF
(
Figure 2 and Figure 3)
0.5
2.0
3.5
ns
t
PLHD
Differential Propagation Delay Low to High
0.5
2.1
3.5
ns
t
SKD
Differential Skew |t
PHLD
– t
PLHD
|
0
80
900
ps
t
SK1
Channel-to-Channel Skew (Note 4)
0
0.3
1.0
ns
t
SK2
Chip to Chip Skew (Note 5)
3.0
ns
t
TLH
Rise Time
0.35
2.0
ns
t
THL
Fall Time
0.35
2.0
ns
t
PHZ
Disable Time High to Z
R
L
= 100
Ω
,
C
L
= 5 pF
(
Figure 4 and Figure 5)
2.5
15
ns
t
PLZ
Disable Time Low to Z
2.5
15
ns
t
PZH
Enable Time Z to High
2.5
15
ns
t
PZL
Enable Time Z to Low
2.5
15
ns
Switching Characteristics
V
CC
= +5.0V
±
10%, T
A
= −55˚C to +125˚C DS90C031E. (Notes 3, 4, 5, 6, 9, 10)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
t
PHLD
Differential Propagation Delay High to Low
R
L
= 100
Ω
, C
L
= 20 pF
(
Figure 3)
C
L
Connected between
each Output and GND
0.5
2.0
5.0
ns
t
PLHD
Differential Propagation Delay Low to High
0.5
2.1
5.0
ns
t
SKD
Differential Skew |t
PHLD
– t
PLHD
|
0
0.08
3.0
ns
t
SK1
Channel-to-Channel Skew (Note 4)
0
0.3
3.0
ns
t
SK2
Chip to Chip Skew (Note 5)
4.5
ns
t
PHZ
Disable Time High to Z
R
L
= 100
Ω
,
C
L
= 5 pF
(
Figure 4 and Figure 5)
2.5
20
ns
t
PLZ
Disable Time Low to Z
2.5
20
ns
t
PZH
Enable Time Z to High
2.5
20
ns
t
PZL
Enable Time Z to Low
2.5
20
ns
Parameter Measurement Information
DS011946-3
FIGURE 1. Driver V
OD
and V
OS
Test Circuit
www.national.com
4
Parameter Measurement Information
(Continued)
DS011946-4
FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit
DS011946-5
FIGURE 3. Driver Propagation Delay and Transition Time Waveforms
DS011946-6
FIGURE 4. Driver TRI-STATE Delay Test Circuit
www.national.com
5
Parameter Measurement Information
(Continued)
Typical Application
Applications Information
LVDS drivers and receivers are intended to be primarily used
in an uncomplicated point-to-point configuration as is shown
in
Figure 6. This configuration provides a clean signaling en-
vironment for the quick edge rates of the drivers. The re-
ceiver is connected to the driver through a balanced media
which may be a standard twisted pair cable, a parallel pair
cable, or simply PCB traces. Typically, the characteristic im-
pedance of the media is in the range of 100
Ω
. A termination
resistor of 100
Ω
should be selected to match the media, and
is located as close to the receiver input pins as possible. The
termination resistor converts the current sourced by the
driver into a voltage that is detected by the receiver. Other
configurations are possible such as a multi-receiver configu-
ration, but the effects of a mid-stream connector(s), cable
stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination
loading must be taken into account.
The DS90C031 differential line driver is a balanced current
source design. A current mode driver, generally speaking
has a high output impedance and supplies a constant cur-
rent for a range of loads (a voltage mode driver on the other
hand supplies a constant voltage for a range of loads). Cur-
rent is switched through the load in one direction to produce
a logic state and in the other direction to produce the other
logic state. The typical output current is mere 3.4 mA, a mini-
mum of 2.5 mA, and a maximum of 4.5 mA. The current
mode requires (as discussed above) that a resistive termi-
nation be employed to terminate the signal and to complete
the loop as shown in
Figure 6. AC or unterminated configu-
rations are not allowed. The 3.4 mA loop current will develop
a differential voltage of 340 mV across the 100
Ω
termination
resistor which the receiver detects with a 240 mV minimum
differential noise margin neglecting resistive line losses
(driven signal minus receiver threshold (340 mV – 100 mV =
240 mV)). The signal is centered around +1.2V (Driver Off-
set, V
OS
) with respect to ground as shown in
Figure 7. Note
that the steady-state voltage (V
SS
) peak-to-peak swing is
twice the differential voltage (V
OD
) and is typically 680 mV.
The current mode driver provides substantial benefits over
voltage mode drivers, such as an RS-422 driver. Its quies-
cent current remains relatively flat versus switching fre-
quency. Whereas the RS-422 voltage mode driver increases
exponentially in most case between 20 MHz–50 MHz. This
is due to the overlap current that flows between the rails of
the device when the internal gates switch. Whereas the cur-
rent mode driver switches a fixed current between its output
without any substantial overlap current. This is similar to
some ECL and PECL devices, but without the heavy static
I
CC
requirements of the ECL/PECL designs. LVDS requires
80% less current than similar PECL devices. AC specifica-
tions for the driver are a tenfold improvement over other ex-
isting RS-422 drivers.
The TRI-STATE function allows the driver outputs to be dis-
abled, thus obtaining an even lower power state when the
transmission of data is not required.
DS011946-7
FIGURE 5. Driver TRI-STATE Delay Waveform
DS011946-8
FIGURE 6. Point-to-Point Application
www.national.com
6
Applications Information
(Continued)
The footprint of the DS90C031 is the same as the industry
standard 26LS31 Quad Differential (RS-422) Driver.
Pin Descriptions
Pin No.
Name
Description
(SOIC)
1, 7,
9, 15
D
IN
Driver input pin, TTL/CMOS
compatible
2, 6,
10, 14
D
OUT+
Non-inverting driver output pin,
LVDS levels
3, 5,
11, 13
D
OUT−
Inverting driver output pin,
LVDS levels
4
EN
Active high enable pin, OR-ed
with EN*
12
EN*
Active low enable pin, OR-ed
with EN
Pin No.
Name
Description
(SOIC)
16
V
CC
Power supply pin, +5V
±
10%
8
GND
Ground pin
Ordering Information
Operating
Package Type/
Order Number
Temperature
Number
−40˚C to +85˚C
SOP/M16A
DS90C031TM
−55˚C to +125˚C
LCC/E20A
DS90C031E-QML
DS90C031E-QML
(NSID)
5962-95833
(SMD)
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: V
OD1
and
∆
V
OD1
.
Note 3: All typicals are given for: V
CC
= +5.0V, T
A
= +25˚C.
Note 4: Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event
on the inputs.
Note 5: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Note 6: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z
O
= 50
Ω
, t
r
≤
6 ns, and t
f
≤
6 ns.
Note 7: ESD Ratings:
HBM (1.5 k
Ω
, 100 pF)
≥
3,500V
EIAJ (0
Ω
, 200 pF)
≥
250V
Note 8: Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only.
Note 9: C
L
includes probe and jig capacitance.
Note 10: Guaranteed by characterization data (DS90C031E).
DS011946-9
FIGURE 7. Driver Output Levels
www.national.com
7
Typical Performance Characteristics
Power Supply Current
vs Power Supply Voltage
DS011946-10
Power Supply Current
vs Temperature
DS011946-11
Power Supply Current
vs Power Supply Voltage
DS011946-12
Power Supply Current
vs Temperature
DS011946-13
Output TRI-STATE Current
vs Power Supply Voltage
DS011946-14
Output Short Circuit Current
vs Power Supply Voltage
DS011946-15
www.national.com
8
Typical Performance Characteristics
(Continued)
Differential Output Voltage
vs Power Supply Voltage
DS011946-16
Differential Output Voltage
vs Ambient Temperature
DS011946-17
Output Voltage High vs
Power Supply Voltage
DS011946-18
Output Voltage High vs
Ambient Temperature
DS011946-19
Output Voltage Low vs
Power Supply Voltage
DS011946-20
Output Voltage Low vs
Ambient Temperature
DS011946-21
www.national.com
9
Typical Performance Characteristics
(Continued)
Offset Voltage vs
Power Supply Voltage
DS011946-22
Offset Voltage vs
Ambient Temperature
DS011946-23
Power Supply Current
vs Frequency
DS011946-24
Power Supply Current
vs Frequency
DS011946-25
Differential Output Voltage
vs Load Resistor
DS011946-26
Differential Propagation Delay
vs Power Supply Voltage
DS011946-27
www.national.com
10
Typical Performance Characteristics
(Continued)
Differential Propagation Delay
vs Ambient Temperature
DS011946-28
Differential Skew vs
Power Supply Voltage
DS011946-29
Differential Skew vs
Ambient Temperature
DS011946-30
Differential Transition Time
vs Power Supply Voltage
DS011946-31
Differential Transition Time
vs Ambient Temperature
DS011946-32
www.national.com
11
12
Physical Dimensions
inches (millimeters) unless otherwise noted
20-Lead Ceramic Leadless Chip Carrier, Type C
Order Number DS90C031E-QML
NS Package Number E20A
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90C031TM
NS Package Number M16A
www.national.com
13
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-
CONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or sys-
tems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose fail-
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
www.national.com
National Semiconductor
Europe
Fax: +49 (0) 1 80-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 1 80-530 85 85
English
Tel: +49 (0) 1 80-532 78 32
Français Tel: +49 (0) 1 80-532 93 58
Italiano
Tel: +49 (0) 1 80-534 16 80
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: sea.support@nsc.com
National Semiconductor
Japan Ltd.
Tel: 81-3-5620-6175
Fax: 81-3-5620-6179
DS90C031
L
VDS
Quad
CMOS
Differential
Line
Driver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.