DATA SHEET
Product specification
Supersedes data of February 1994
File under Discrete Semiconductors, SC01
1996 May 24
DISCRETE SEMICONDUCTORS
BYM26 series
Fast soft-recovery
controlled avalanche rectifiers
handbook, 2 columns
M3D118
1996 May 24
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
FEATURES
•
Glass passivated
•
High maximum operating
temperature
•
Low leakage current
•
Excellent stability
•
Guaranteed avalanche energy
absorption capability
•
Available in ammo-pack
•
Also available with preformed leads
for easy insertion.
DESCRIPTION
Rugged glass SOD64 package,
using a high temperature alloyed
construction. This package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
Fig.1 Simplified outline (SOD64) and symbol.
2/3 page (Datasheet)
MAM104
k
a
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
RRM
repetitive peak reverse voltage
−
200
V
−
400
V
−
600
V
−
800
V
−
1000
V
−
1200
V
−
1400
V
V
R
continuous reverse voltage
−
200
V
−
400
V
−
600
V
−
800
V
−
1000
V
−
1200
V
−
1400
V
I
F(AV)
average forward current
T
tp
= 55
°
C; lead length = 10 mm;
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
−
2.30
A
−
2.40
A
I
F(AV)
average forward current
T
amb
= 65
°
C; PCB mounting (see
Fig.19); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
−
1.05
A
−
1.00
A
1996 May 24
3
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
ELECTRICAL CHARACTERISTICS
T
j
= 25
°
C unless otherwise specified.
I
FRM
repetitive peak forward current
T
tp
= 55
°
C; see Figs 6 and 7
−
19
A
−
21
A
I
FRM
repetitive peak forward current
T
amb
= 65
°
C; see Figs 8 and 9
−
8.0
A
−
8.5
A
I
FSM
non-repetitive peak forward current
t = 10 ms half sine wave; T
j
= T
j max
prior to surge; V
R
= V
RRMmax
−
45
A
E
RSM
non-repetitive peak reverse
avalanche energy
L = 120 mH; T
j
= T
j max
prior to surge;
inductive load switched off
−
10
mJ
T
stg
storage temperature
−
65
+175
°
C
T
j
junction temperature
see Figs 12 and 13
−
65
+175
°
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
F
forward voltage
I
F
= 2 A; T
j
= T
j max
;
see Figs 14 and 15
−
−
1.34
V
−
−
1.34
V
V
F
forward voltage
I
F
= 2 A;
see Figs 14 and 15
−
−
2.65
V
−
−
2.30
V
V
(BR)R
reverse avalanche breakdown
voltage
I
R
= 0.1 mA
300
−
−
V
500
−
−
V
700
−
−
V
900
−
−
V
1100
−
−
V
1300
−
−
V
1500
−
−
V
I
R
reverse current
V
R
= V
RRMmax
;
see Fig.16
−
−
10
µ
A
V
R
= V
RRMmax
;
T
j
= 165
°
C; see Fig.16
−
−
150
µ
A
t
rr
reverse recovery time
when switched from
I
F
= 0.5 A to I
R
= 1 A;
measured at I
R
= 0.25 A;
see Fig.20
−
−
30
ns
−
−
75
ns
−
−
150
ns
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
1996 May 24
4
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
≥
40
µ
m, see Fig.19.
For more information please refer to the
‘General Part of Handbook SC01’.
C
d
diode capacitance
f = 1 MHz; V
R
= 0 V;
see Figs 17 and 18
−
85
−
pF
−
75
−
pF
−
65
−
pF
maximum slope of reverse recovery
current
when switched from
I
F
= 1 A to V
R
≥
30 V and
dI
F
/dt =
−
1 A/
µ
s;
see Fig.21
−
−
7
A/
µ
s
−
−
6
A/
µ
s
−
−
5
A/
µ
s
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-tp
thermal resistance from junction to tie-point
lead length = 10 mm
25
K/W
R
th j-a
thermal resistance from junction to ambient
note 1
75
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dI
R
dt
--------
1996 May 24
5
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
GRAPHICAL DATA
handbook, halfpage
0
200
2.4
0
MSA875
0.6
100
I F(AV)
(A)
1.2
1.8
lead length (mm)
20 15
10
T ( C)
o
tp
a = 1.42; V
R
= V
RRMmax
;
δ
= 0.5.
Switched mode application.
Fig.2
Maximum average forward current as a
function of tie-point temperature (including
losses due to reverse leakage).
handbook, halfpage
0
200
3
0
1
MBD421
100
I F(AV)
(A)
T ( C)
o
tp
2
lead length 10 mm
a = 1.42; V
R
= V
RRMmax
;
δ
= 0.5.
Switched mode application.
Fig.3
Maximum average forward current as a
function of tie-point temperature (including
losses due to reverse leakage).
a = 1.42; V
R
= V
RRMmax
;
δ
= 0.5.
Device mounted as shown in Fig.19.
Switched mode application.
Fig.4
Maximum average forward current as a
function of ambient temperature (including
losses due to reverse leakage).
handbook, halfpage
0
200
2.0
0
0.4
1.6
MLB490
100
I F(AV)
(A)
T ( C)
o
amb
0.8
1.2
handbook, halfpage
0
200
2.0
0
0.4
1.6
MBD416
100
I F(AV)
(A)
T ( C)
o
amb
0.8
1.2
a = 1.42; V
R
= V
RRMmax
;
δ
= 0.5.
Device mounted as shown in Fig.19.
Switched mode application.
Fig.5
Maximum average forward current as a
function of ambient temperature (including
losses due to reverse leakage).
1996 May 24
6
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
0
8
10
2
10
1
1
10
10
2
10
3
10
4
MSA879
16
20
4
12
t (ms)
p
I FRM
(A)
= 0.05
δ
0.1
0.2
0.5
1
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
T
tp
= 55
°
C; R
th j-tp
= 25 K/W.
V
RRMmax
during 1
− δ
; curves include derating for T
j max
at V
RRM
= 1000 V.
0
10
10
2
1
10
10
2
10
3
10
4
MBD449
20
t (ms)
p
10
1
I FRM
(A)
5
15
25
= 0.05
δ
0.1
0.2
0.5
1
T
tp
= 55
°
C; R
th j-tp
= 25 K/W.
V
RRMmax
during 1
− δ
; curves include derating for T
j max
at V
RRM
= 1400 V.
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 May 24
7
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
0
4
10
2
10
1
1
10
10
2
10
3
10
4
MSA878
8
10
2
6
t (ms)
p
I FRM
(A)
= 0.05
δ
0.1
0.2
0.5
1
T
amb
= 65
°
C; R
th j-a
= 75 K/W.
V
RRMmax
during 1
− δ
; curves include derating for T
j max
at V
RRM
= 1000 V.
Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
0
4
10
2
1
10
10
2
10
3
10
4
MBD443
8
t (ms)
p
10
1
I FRM
(A)
2
6
10
= 0.05
δ
0.1
0.2
0.5
1
Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
T
amb
= 65
°
C; R
th j-a
= 75 K/W.
V
RRMmax
during 1
− δ
; curves include derating for T
j max
at V
RRM
= 1400 V.
1996 May 24
8
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
5
0
0.6
2.4
0
MSA876
1.2
1
2
3
4
1.8
I F(AV)(A)
P
(W)
a = 3
2.5
2 1.57
1.42
Fig.10 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
a = I
F(RMS)
/I
F(AV)
; V
R
= V
RRMmax
;
δ
= 0.5.
Switched mode application.
Fig.11 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
a = I
F(RMS)
/I
F(AV)
; V
R
= V
RRMmax
;
δ
= 0.5.
Switched mode application.
0
5
0
2
4
MBD430
I (A)
F(AV)
2.4
0.6
1.8
P
(W)
3
1
1.2
a = 3
2.5
2 1.57 1.42
handbook, halfpage
200
0
400
1200
0
MSA873
800
100
V (V)
R
A
B
C
D
E
Tj
(
°
C)
Fig.12 Maximum permissible junction temperature
as a function of reverse voltage.
Solid line = V
R
.
Dotted line = V
RRM
;
δ
= 0.5.
Fig.13 Maximum permissible junction temperature
as a function of reverse voltage.
Solid line = V
R
.
Dotted line = V
RRM
;
δ
= 0.5.
handbook, halfpage
200
0
2000
0
MLB601
1000
100
V (V)
R
T j
( C)
o
F
G
1996 May 24
9
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
Dotted line: T
j
= 175
°
C.
Solid line: T
j
= 25
°
C.
Fig.14 Forward current as a function of forward
voltage; maximum values.
handbook, halfpage
0
2
4
VF (V)
6
10
(A)
IF
0
8
MSA877
6
4
2
Dotted line: T
j
= 175
°
C.
Solid line: T
j
= 25
°
C.
Fig.15 Forward current as a function of forward
voltage; maximum values.
handbook, halfpage
0
2
VF (V)
4
10
(A)
IF
0
8
MBD426
6
4
2
Fig.16 Reverse current as a function of junction
temperature; maximum values.
handbook, halfpage
MGC549
0
100
200
10
3
10
2
10
1
(
µ
A)
IR
Tj (
°
C)
V
R
= V
RRMmax
.
handbook, halfpage
1
MSA874
10
10
2
10
3
1
10
2
10
V (V)
R
Cd
(pF)
f = 1 MHz; T
j
= 25
°
C.
Fig.17 Diode capacitance as a function of reverse
voltage; typical values.
1996 May 24
10
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
handbook, halfpage
1
MBD435
10
10
2
10
3
1
10
2
10
V (V)
R
C d
(pF)
f = 1 MHz; T
j
= 25
°
C.
Fig.18 Diode capacitance as a function of reverse
voltage; typical values.
Fig.19 Device mounted on a printed-circuit board.
Dimensions in mm.
handbook, halfpage
MGA200
3
2
7
50
25
50
handbook, full pagewidth
10
Ω
1
Ω
50
Ω
25 V
DUT
MAM057
+
t rr
0.5
0
0.5
1
IF
(A)
IR
(A)
t
0.25
Fig.20 Test circuit and reverse recovery time waveform and definition.
Input impedance oscilloscope: 1 M
Ω
, 22 pF; t
r
≤
7 ns.
Source impedance: 50
Ω
; t
r
≤
15 ns.
1996 May 24
11
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
andbook, halfpage
10%
100%
dI
dt
t
trr
IF
IR
MGC499
F
dI
dt
R
1996 May 24
12
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYM26 series
PACKAGE OUTLINE
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains prelimina