Applications
• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL
• Low Input Current Line
Receiver
• High Voltage Insulation
(HCNW139/138)
• EIA RS-232C Line Receiver
• Telephone Ring Detector
• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation
• Low Power Systems –
Ground Isolation
Low Input Current, High Gain
Optocouplers
Technical Data
Features
• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)
• Low Input Current
Requirements – 0.5 mA
• TTL Compatible Output –
0.1 V V
OL
Typical
• Performance Guaranteed
over Temperature 0
°
C
to 70
°
C
• Base Access Allows Gain
Bandwidth Adjustment
• High Output Current –
60 mA
• Safety Approval
UL Recognized – 2500 V rms
for 1 Minute and 5000 V rms*
for 1 Minute per UL 1577
CSA Approved
VDE 0884 Approved with
V
IORM
= 1414 V
peak
for
HCNW139 and HCNW138
BSI Certified (HCNW139 and
HCNW138)
• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package
•MIL-STD-1772 Version
Available (HCPL-5700/1)
Description
These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec-
tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the V
CC
and V
O
terminals may be
tied together to achieve conven-
tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.
6N139
6N138
HCPL-0701
HCPL-0700
HCNW139
HCNW138
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1
µ
F bypass capacitor connected between pins 8 and 5 is recommended.
Functional Diagram
7
1
2
3
4
5
6
8
NC
ANODE
CATHODE
NC
VCC
VO
GND
TRUTH TABLE
LED
ON
OFF
VO
LOW
HIGH
VB
2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70
°
C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70
°
C
for an LED current of 1.6 mA
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 k
Ω
pull-up resistor.
Selection for lower input current
down to 250
µ
A is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
Widebody
8-Pin DIP
Package
Hermetic
(300 Mil)
Small Outline SO-8
(400 mil)
Single and
Dual
Single
Dual
Minimum
Absolute
Dual
Single
Channel
Channel
Channel
Single
Input ON
Maxi-
Channel
Channel
Package
Package
Package
Channel
Current
Minimum
mum
Packages
Package
HCPL-
HCPL-
HCPL-
Package
(I
F
)
CTR
V
CC
HCPL-
6N139
2731
[1]
0701
0731
HCNW139
0.5 mA
400%
18 V
6N138
2730
[1]
0700
0730
HCNW138
1.6 mA
300%
7 V
HCPL-4701
[1]
4731
[1]
070A
[1]
073A
[1]
40
µ
A
800%
18 V
0.5 mA
300%
20 V
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Note:
1. Technical data are on separate HP publications.
3
IF
8
VCC
2
3
ICC
VF
ANODE
CATHODE
+
–
VB
IB
6
5
GND
VO
IO
7
SHIELD
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
6N139#XXX
020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.
Schematic
4
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
HP XXXXZ
YYWW
DATE CODE
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5
6
7
8
4
3
2
1
5° TYP.
OPTION CODE*
UL
RECOGNITION
UR
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.194 (0.047)
1.194 (0.047)
1.778 (0.070)
9.398 (0.370)
9.906 (0.390)
4.826
(0.190)
TYP.
0.381 (0.015)
0.635 (0.025)
PAD LOCATION (FOR REFERENCE ONLY)
1.080 ± 0.320
(0.043 ± 0.013)
4.19
(0.165)
MAX.
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
**JEDEC Registered Data.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
8-Pin Widebody DIP Package (HCNW139/HCNW138)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
1.78 ± 0.15
(0.070 ± 0.006)
5.10
(0.201)
MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
7° TYP.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400)
TYP.
HP
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
XXX
YWW
8
7
6
5
4
3
2
1
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSG
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
45° X
0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
6
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
6.15
(0.242)TYP.
0.9
(0.035)
PAD LOCATION (FOR REFERENCE ONLY)
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)
MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
MAX.
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
Note: Use of nonchlorine activated fluxes is highly recommended.
Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount
Option 300 Parts)
240
∆
T = 115°C, 0.3°C/SEC
0
∆
T = 100°C, 1.5°C/SEC
∆
T = 145°C, 1°C/SEC
TIME – MINUTES
TEMPERATURE – °C
220
200
180
160
140
120
100
80
60
40
20
0
260
1
2
3
4
5
6
7
8
9
10
11
12
7
Regulatory Information
The 6N139/138, HCNW139/138,
and HCPL-0701/0700 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE 0884/
06.92 (HCNW139/138 only).
BSI
Certification according to
BS415:1994,
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW139/
HCNW138 only.)
Insulation and Safety Related Specifications
8-Pin DIP
Widebody
(300 Mil)
SO-8
(400 Mil)
Parameter
Symbol
Value
Value
Value
Units
Conditions
Minimum External
L(101)
7.1
4.9
9.6
mm
Measured from input terminals
Air Gap (External
to output terminals, shortest
Clearance)
distance through air.
Minimum External
L(102)
7.4
4.8
10.0
mm
Measured from input terminals
Tracking (External
to output terminals, shortest
Creepage)
distance path along body.
Minimum Internal
0.08
0.08
1.0
mm
Through insulation distance,
Plastic Gap
conductor to conductor, usually
(Internal Clearance)
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
NA
NA
4.0
mm
Measured from input terminals
Tracking (Internal
to output terminals, along
Creepage)
internal cavity.
Tracking Resistance
CTI
200
200
200
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group
IIIa
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
8
VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138)
Description
Symbol
Characteristic
Units
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
600 V rms
I-IV
for rated mains voltage
≤
1000 V rms
I-III
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
Maximum Working Insulation Voltage
V
IORM
1414
V
peak
Input to Output Test Voltage, Method b*
V
PR
= 1.875 x V
IORM
, 100% Production Test with t
P
= 1 sec,
V
PR
2652
V
peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
PR
= 1.5 x V
IORM
, Type and Sample Test,
V
PR
2121
V
peak
t
P
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
V
IOTM
8000
V
peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
T
S
175
°
C
Current (Input Current I
F
, P
S
= 0)
I
S,INPUT
400
mA
Output Power
P
S,OUTPUT
700
mW
Insulation Resistance at T
S
, V
IO
= 500 V
R
S
> 10
9
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
9
Absolute Maximum Ratings*
(No Derating Required up to 85
°
C)
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
T
S
-55
125
°
C
Operating Temperature**
T
A
- 40
85
°
C
Average Forward Input Current
I
F(AVG)
20
mA
Peak Forward Input Current
I
FPK
40
mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
I
F(TRAN)
1.0
A
(<1
µ
s Pulse Width, 300 pps)
Reverse Input Voltage
V
R
5
V
HCNW139/138
3
V
Input Power Dissipation
P
I
35
mW
Output Current (Pin 6)
I
O
60
mA
Emitter Base Reverse Voltage (Pin 5-7)
V
EB
0.5
V
Supply Voltage and Output Voltage
V
CC
-0.5
18
V
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage
V
CC
-0.5
7
V
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
P
O
100
mW
Total Power Dissipation
P
T
135
mW
Lead Solder Temperature (for Through Hole Devices)
260
°
C for 10 sec., 1.6 mm below seating plane
HCNW139/138
260
°
C for 10 sec., up to seating plane
Reflow Temperature Profile
See Package Outline Drawings section
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0
°
C to 70
°
C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
V
CC
4.5
18
V
Forward Input Current (ON)
I
F(ON)
0.5
12.0
mA
Forward Input Voltage (OFF)
V
F(OFF)
0
0.8
V
Operating Temperature
T
A
0
70
°
C
10
Electrical Specifications
0
°
C
≤
T
A
≤
70
°
C, 4.5 V
≤
V
CC
≤
18 V, 0.5 mA
≤
I
F(ON)
≤
12 mA, 0 V
≤
V
F(OFF)
≤
0.8 V, unless otherwise
specified. All Typicals at T
A
= 25
°
C. See Note 7.
Parameter
Sym.
Device
Min. Typ.** Max. Units
Test Conditions
Fig.
Note
Current Transfer
CTR
6N139
400* 2000 5000
%
I
F
= 0.5 mA
V
CC
= 4.5
2, 3
1, 2,
Ratio
HCPL-0701
V
O
= 0.4 V
4
HCNW139
400
4500
6N139
500* 1600 2600
I
F
= 1.6 mA
HCPL-0701
HCNW139
500
3000
300
1600
I
F
= 5.0 mA
200
850
I
F
= 12 mA
6N138
300* 1600 2600
I
F
= 1.6 mA
HCPL-0700
HCNW138
1500
Logic Low Output
V
OL
6N139
0.1
0.4
V
I
F
= 0.5 mA,
V
CC
= 4.5
1
2
Voltage
HCPL-0701
I
O
= 2 mA
HCNW139
I
F
= 1.6 mA,
I
O
= 8 mA
I
F
= 5.0 mA,
I
O
= 15 mA
0.2
I
F
= 12 mA,
I
O
= 24 mA
6N138
0.1
I
F
= 1.6 mA,
HCPL-0700
I
O
= 4.8 mA
HCNW138
Logic High
I
OH
6N139
0.05
100
µ
A
V
O
= V
CC
= 18 V I
F
= 0 mA
2
Output Current
HCPL-0701
HCNW139
6N138
0.1
250
V
O
= V
CC
= 7 V
HCPL-0700
HCNW138
Logic Low Supply
I
CCL
6N138/139
0.4
1.5
mA
I
F
= 1.6 mA, V
O
= Open,
10
2
Current
HCPL-0701/
V
CC
= 18 V
0700
HCNW139
0.5
2
HCNW138
Logic High
I
CCH
6N138/139
0.01
10
µ
A
I
F
= 0 mA, V
O
= Open,
2
Supply Current
HCPL-0701/
V
CC
= 18 V
0700
HCNW139
1
HCNW138
Input Forward
V
F
6N138
1.25
1.40
1.7*
V
T
A
= 25
°
C
I
F
= 1.6 mA
4, 8
Voltage
6N139
HCPL-0701
1.75
HCPL-0700
HCNW139
1.0
1.45
1.85
T
A
= 25
°
C
HCNW138
0.95
1.95
Input Reverse
BVR
5.0*
V
I
R
= 10
µ
A, T
A
= 25
°
C
HCNW139
3.0
I
R
= 100
µ
A, T
A
= 25
°
C
HCNW138
Temperature
∆
V
F
-1.8
mV/