LM4867
Output-Transient-Free Dual 2.1W Audio Amplifier Plus
No Coupling Capacitor Stereo Headphone Function
General Description
The LM4867 is a dual bridge-connected audio power ampli-
fier which, when connected to a 5V supply, will deliver 2.1W
to a 4
Ω
load (Note 1) or 2.4W to a 3
Ω
load (Note 2) with less
than 1.0% THD+N. The LM4867 uses advanced, latest gen-
eration circuitry to eliminate all traces of clicks and pops
when the supply voltage is first applied. The amplifier has a
headphone-amplifier-select input pin. It is used to switch the
amplifiers from bridge to single-ended mode for driving
headphones. A new circuit topology eliminates headphone
output coupling capacitors. A MUX control pin allows selec-
tion between the two sets of stereo input signals. The MUX
control can also be used to select between two different
customer-specified closed-loop responses.
Boomer audio power amplifiers are designed specifically to
provide high quality output power from a surface mount
package and require few external components. To simplify
audio system design, the LM4867 combines dual bridge
speaker amplifiers and stereo headphone amplifiers in one
package.
The LM4867 features an externally controlled power-saving
micropower shutdown mode, a stereo headphone amplifier
mode, and thermal shutdown protection.
Note 1: An LM4867LQ or LM4867MTE that has been properly mounted to
a circuit board will deliver 2.1W into 4
Ω
. The Mux control can also be used to
select two different closed-loop responses. LM4867MT will deliver 1.1W into
8
Ω
. See the Application Information sections for further information concern-
ing the LM4867LQ and the LM4867MT.
Note 2: An LM4867LQ or LM4867MTE that has been properly mounted to a
circuit board and forced-air cooled will deliver 2.4W into 3
Ω
.
Key Specifications
n
P
O
at 1% THD+N
n
LM4867LQ, 3
Ω
load
2.4W (typ)
n
LM4867LQ, 4
Ω
load
2.1W (typ)
n
LM4867MTE, 4
Ω
1.9W (typ)
n
LM4867MT, 8
Ω
1.1W (typ)
n
Single-ended mode - THD+N at 75mW into 32
Ω
0.5%
(max)
n
Shutdown current
0.7µA (typ)
Features
n
Advanced “click and pop” suppression circuitry
n
Eliminates headphone amplifier output coupling
capacitors
n
Stereo headphone amplifier mode
n
Input mux control and two separate inputs per channel
n
Thermal shutdown protection circuitry
n
LLP, TSSOP, and exposed-DAP TSSOP packaging
available
Applications
n
Multimedia monitors
n
Portable and desktop computers
n
Portable audio systems
Typical Application
Boomer
®
is a registered trademark of National Semiconductor Corporation.
DS200013-31
*
Refer to the Application Information section titled PROPER SELECTION OF EXTERNAL COMPONENTS for details concerning the value of C
B
.
FIGURE 1. Typical Audio Amplifier Application Circuit
(Pin out shown for the 24-pin Exposed-DAP LLP package. Numbers in ( ) are for the 20-pin MTE and MT
packages.)
February 2001
LM4867
Output-T
ransient-Free
Dual
2.1W
Audio
Amplifier
Plus
No
Coupling
Capacitor
Stereo
Headphone
Function
© 2001 National Semiconductor Corporation
DS200013
www.national.com
Connection Diagram
Connection Diagram
DS200013-58
Top View
Order Number LM4867MT, LM4867MTE
See NS Package Number MTC20 for TSSOP
See NS Package Number MXA20A for Exposed-DAP TSSOP
DS200013-38
Top View
Order Number LM4867LQ
See NS Package Number LQA24A for Exposed-DAP LLP
LM4867
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2
Absolute Maximum Ratings
(Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
6.0V
Storage Temperature
−65˚C to +150˚C
Input Voltage
−0.3V to V
DD
+0.3V
Power Dissipation (Note 4)
Internally limited
ESD Susceptibility (Note 5)
All pins except Pin 3 (MT, MTE), Pin 2 (LQ)
2000V
Pin 3 (MT, MTE), Pin 2 (LQ)
8000V
ESD Susceptibility (Note 6)
200V
Junction Temperature
150˚C
Solder Information
Small Outline Package
Vapor Phase (60 sec.)
215˚C
Infrared (15 sec.)
220˚C
See AN-450 “Surface Mounting and their Effects on
Product Reliablilty” for other methods of soldering surface
mount devices.
Thermal Resistance
θ
JC
(typ) — MTC20
20˚C/W
θ
JA
(typ) — MTC20
80˚C/W
θ
JC
(typ) — MXA20A
2˚C/W
θ
JA
(typ) — MXA20A
41˚C/W (Note 7)
θ
JA
(typ) — MXA20A
51˚C/W (Note 8)
θ
JA
(typ) — MXA20A
90˚C/W (Note 9)
θ
JC
(typ) — LQA24A
3.0˚C/W
θ
JA
(typ) — LQA24A
TBD˚C/W (Note 10)
θ
JA
(typ) — LQA24A
TBD˚C/W (Note 11)
θ
JA
(typ) — LQA24A
TBD˚C/W (Note 12)
Operating Ratings
Temperature Range
T
MIN
≤
T
A
≤
T
MAX
−40˚C
≤
T
A
≤
85˚C
Supply Voltage
2.0V
≤
V
DD
≤
5.5V
Electrical Characteristics for Entire IC
(Notes 3, 13)
The following specifications apply for V
DD
= 5V unless otherwise noted. Limits apply for T
A
= 25˚C.
Symbol
Parameter
Conditions
LM4867
Units
(Limits)
Typical
Limit
(Note 14)
(Note 15)
V
DD
Supply Voltage
2
V (min)
5.5
V (max)
I
DD
Quiescent Power Supply Current
V
IN
= 0V, I
O
= 0A (Note 16) , HP-IN = 0V
7.5
15
mA (max)
V
IN
= 0V, I
O
= 0A (Note 16) , HP-IN = 4V
3.0
6
mA (max)
I
SD
Shutdown Current
V
DD
applied to the SHUTDOWN pin
0.7
2
µA (max)
Electrical Characteristics for Bridged-Mode Operation
(Notes 3, 13)
The following specifications apply for V
DD
= 5V unless otherwise specified. Limits apply for T
A
= 25˚C.
Symbol
Parameter
Conditions
LM4867
Units
(Limits)
Typical
Limit
(Note 14)
(Note 15)
V
OS
Output Offset Voltage
V
IN
= 0V
5
50
mV (max)
P
O
Output Power (Note 17)
THD = 1%, f = 1kHz
LM4867MTE, R
L
= 3
Ω
(Note 18)
2.2
W
LM4867LQ, R
L
= 3
Ω
(Note 18)
2.2
W
LM4867MTE, R
L
= 4
Ω
(Note 19)
1.9
W
LM4867LQ, R
L
= 4
Ω
(Note 19)
1.9
W
LM4867, R
L
= 8
Ω
1.1
1.0
W (min)
THD+N = 10%, f = 1kHz
LM4867MTE, R
L
= 3
Ω
(Note 18)
3.0
W
LM4867LQ, R
L
= 3
Ω
(Note 18)
3.0
W
LM4867MTE, R
L
= 4
Ω
(Note 19)
2.6
W
LM4867LQ, R
L
= 4
Ω
(Note 19)
2.6
W
LM4867, R
L
= 8
Ω
1.5
W
THD+N = 1%, f = 1 kHz, R
L
= 32
Ω
0.34
W
LM4867
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3
Electrical Characteristics for Bridged-Mode Operation
(Notes 3, 13) (Continued)
The following specifications apply for V
DD
= 5V unless otherwise specified. Limits apply for T
A
= 25˚C.
Symbol
Parameter
Conditions
LM4867
Units
(Limits)
Typical
Limit
(Note 14)
(Note 15)
THD+N
Total Harmonic Distortion+Noise
20Hz
≤
f
≤
20kHz, A
VD
= 2
LM4867MTE, R
L
= 4
Ω
, P
O
= 2W
LM4867LQ, R
L
= 4
Ω
, P
O
= 2W
LM4867, R
L
= 8
Ω
, P
O
= 1W
0.3
0.3
0.3
%
%
%
PSRR
Power Supply Rejection Ratio
V
DD
= 5V, V
RIPPLE
= 200 mV
RMS
, R
L
= 8
Ω
,
C
B
= 2.2µF
67
dB
X
TALK
Channel Separation
f = 1 kHz, C
B
= 2.2µF
80
dB
SNR
Signal To Noise Ratio
V
DD
= 5V, P
O
= 1.1W, R
L
= 8
Ω
97
dB
Electrical Characteristics for Single-Ended Operation
(Notes 3, 13)
The following specifications apply for V
DD
= 5V unless otherwise specified. Limits apply for T
A
= 25˚C.
Symbol
Parameter
Conditions
LM4867
Units
(Limits)
Typical
Limit
(Note 14)
(Note 15)
V
OS
Output Offset Voltage
V
IN
= 0V
5
50
mV (max)
P
O
Output Power
THD = 0.5%, f = 1kHz, R
L
= 32
Ω
85
75
mW (min)
THD+N = 1%, f = 1kHz, R
L
= 8
Ω
(Note
20)
180
mW
THD+N = 1%, f = 1kHz, R
L
= 16
Ω
THD+N = 10%, f = 1kHz, R
L
= 32
Ω
THD+N = 10%, f = 1kHz, R
L
= 16
Ω
THD+N = 10%, f = 1kHz, R
L
= 32
Ω
165
88
208
114
mW
mW
mW
mW
V
OUT
Output Voltage Swing
THD = 0.05%, R
L
= 5k
Ω
1
V
P-P
THD+N
Total Harmonic Distortion+Noise
A
V
= −1, P
O
= 75mW, 20 Hz
≤
f
≤
20kHz,
R
L
= 32
Ω
0.2
%
PSRR
Power Supply Rejection Ratio
C
B
= 2.2µF, V
RIPPLE
= 200mV
RMS
,
f = 1kHz
52
dB
X
TALK
Channel Separation
f = 1kHz, C
B
= 2.2µF
60
dB
SNR
Signal To Noise Ratio
V
DD
= 5V, P
O
= 340mW, R
L
= 8
Ω
94
dB
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not guaranteed for parameters where
no limit is given. The typical value however, is a good indication of device performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
,
θ
JA
, and the ambient temperature T
A
. The maximum
allowable power dissipation is P
DMAX
= (T
JMAX
− T
A
)/
θ
JA
. For the LM4867, T
JMAX
= 150˚C. For the
θ
JA
s for different packages, please see the Application
Information section or the Absolute Maximum Ratings section.
Note 5: Human body model, 100 pF discharged through a 1.5 k
Ω
resistor.
Note 6: Machine model, 220 pF–240 pF discharged through all pins.
Note 7: The given
θ
JA
is for an LM4867 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 2in
2
area of 1oz printed circuit board copper.
Note 8: The given
θ
JA
is for an LM4867 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 1in
2
area of 1oz printed circuit board copper.
Note 9: The given
θ
JA
is for an LM4867 packaged in an MXA20A with the Exposed-DAP not soldered to printed circuit board copper.
Note 10: The given
θ
JA
is for an LM4867 packaged in an LQA24A with the Exposed-DAP soldered to an exposed 2in
2
area of 1oz printed circuit board copper.
Note 11: The given
θ
JA
is for an LM4867 packaged in an LQA24A with the Exposed-DAP soldered to an exposed 1in
2
area of 1oz printed circuit board copper.
Note 12: The given
θ
JA
is for an LM4867 packaged in an LQA24A with the Exposed-DAP not soldered to printed circuit board copper.
Note 13: All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.
Note 14: Typicals are measured at 25˚C and represent the parametric norm.
Note 15: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test, or
statistical analysis.
Note 16: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
Note 17: Output power is measured at the device terminals.
Note 18: When driving 3
Ω
loads from a 5V supply, the LM4867LQ, LM4867MTE, or LM4867MTE-1 must be mounted to the circuit board and forced-air cooled (450
linear-feet per minute).
Note 19: When driving 4
Ω
loads from a 5V supply, the LM4867LQ, LM4867MTE or LM4867MTE-1 must be mounted to the circuit board.
LM4867
www.national.com
4
Electrical Characteristics for Single-Ended Operation
(Notes 3, 13) (Continued)
Note 20: See Application Information section ’Single-Ended Output Power Performance and Measurement Considerations’ for more information.
Typical Performance Characteristics
MTE- and LQ- Specific Characteristics
Note 21: This curve shows the LM4867MTE’s thermal dissipation ability at different ambient temperatures given these conditions:
500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across
it.
Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + 2.5in
2
: The part is soldered to a 2.5in
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2.5in
2
: The part is soldered to a 2.5in
2
, 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air cooled.
LM4867MTE
THD+N vs Output Power
DS200013-33
LM4867MTE
THD+N vs Frequency
DS200013-34
LM4867LQ
THD+N vs Output Power
DS200013-53
LM4867LQ
THD+N vs Frequency
DS200013-54
LM4867MTE
THD+N vs Output Power
DS200013-36
LM4867LQ
THD+N vs Output Power
DS200013-55
LM4867LQ, LM4867MTE
Power Dissipation vs Power Output
DS200013-61
LM4867LQ, LM4867MTE(Note 21)
Power Derating Curve
DS200013-59
LM4867
www.national.com
5
Typical Performance Characteristics
THD+N vs Frequency
DS200013-3
THD+N vs Frequency
DS200013-4
THD+N vs Frequency
DS200013-5
THD+N vs Output Power
DS200013-6
THD+N vs Output Power
DS200013-7
THD+N vs Output Power
DS200013-8
THD+N vs Output Power
DS200013-65
THD+N vs Frequency
DS200013-63
THD+N vs Output Power
DS200013-66
THD+N vs Frequency
DS200013-64
Output Power vs
Load Resistance
DS200013-62
Power Dissipation vs
Supply Voltage
DS200013-60
LM4867
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6
Typical Performance Characteristics
(Continued)
Output Power vs
Supply Voltage
DS200013-9
Output Power vs
Supply Voltage
DS200013-10
Output Power vs
Supply Voltage
DS200013-11
Output Power vs
Load Resistance
DS200013-12
Output Power vs
Load Resistance
DS200013-13
Power Dissipation vs
Output Power
DS200013-14
Dropout Voltage vs
Supply Voltage
DS200013-15
Power Derating Curve
DS200013-16
Power Dissipation vs
Output Power
DS200013-17
LM4867
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7
Typical Performance Characteristics
(Continued)
Noise Floor
DS200013-18
Channel Separation
DS200013-19
Channel Separation
DS200013-20
Power Supply
Rejection Ratio
DS200013-21
Open Loop
Frequency Response
DS200013-22
Supply Current vs
Supply Voltage
DS200013-23
LM4867
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8
External Components Description
( Refer to Figure 1. )
Components
Functional Description
1.
R
i
Inverting input resistance which sets the closed-loop gain in conjunction with R
f
. This resistor also forms a
high pass filter with C
i
at f
c
= 1/(2
π
R
i
C
i
).
2.
C
i
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with R
i
at f
c
= 1/(2
π
R
i
C
i
). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of C
i
.
3.
R
f
Feedback resistance which sets the closed-loop gain in conjunction with R
i
.
4.
C
s
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
5.
C
B
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of
External Components, for information concerning proper placement and selection of C
B
.
Application Information
ELIMINATING OUTPUT COUPLING CAPACITORS
Typical single-supply audio amplifiers that can switch be-
tween
driving
bridge-tied-load
(BTL)
speakers
and
single-ended (SE) headphones use a coupling capacitor on
each SE output. This capacitor blocks the half-supply volt-
age to which the output amplifiers are typically biased and
couples the audio signal to the headphones. The signal
return to circuit ground is through the headphone jack’s
sleeve.
The LM4867 eliminates these coupling capacitors. Amp2A is
internally configured to apply V
DD
/2 to a stereo headphone
jack’s sleeve. This voltage matches the quiescent voltage
present on the Amp1A and Amp1B outputs that drive the
headphones. The headphones operate in a manner very
similar to a bridge-tied-load (BTL). The same DC voltage is
applied to both headphone speaker terminals. This results in
no net DC current flow through the speaker. AC current flows
through a headphone speaker as an audio signal’s output
amplitude increases on the speaker’s terminal.
When operating as a headphone amplifier, the headphone
jack sleeve is not connected to circuit ground. Using the
headphone output jack as a line-level output will place the
LM4867’s one-half supply voltage on a plug’s sleeve con-
nection.
Driving
a
portable
notebook
computer
or
audio-visual display equipment is possible. This presents no
difficulty when the external equipment uses capacitively
coupled inputs. For the very small minority of equipment that
is DC-coupled, the LM4867 monitors the current supplied by
the amplifier that drives the headphone jack’s sleeve. If this
current exceeds 500mA
PK
, the amplifier is shutdown, pro-
tecting the LM4867 and the external equipment. For more
information, see the section titled ’Single-Ended Output
Power Performance and Measurement Considerations’.
OUTPUT TRANSIENT (’POPS AND CLICKS’)
ELIMINATED
The LM4867 contains advanced circuitry that eliminates out-
put transients (’pop and click’). This circuitry prevents all
traces of transients when the supply voltage is first applied,
when the part resumes operation after shutdown, or when
switching between BTL speakers and SE headphones. Two
circuits combine to eliminate pop and click. One circuit
mutes the output when switching between speaker loads.
Another circuit monitors the input signal. It maintains the
muted condition until there is sufficient input signal magni-
tude to mask any remaining transient that may occur.
Figure 2 shows the LM4867’s lack of transients in the differ-
ential signal (Trace B) across a BTL 8
Ω
load. The LM4867’s
active-high SHUTDOWN pin is driven by the logic signal
shown in Trace A. Trace C is the VOUT- output signal and
trace D is the VOUT+ output signal. The shutdown signal
frequency is 1Hz with a 50% duty cycle.
Figure 3 is gener-
ated with the same conditions except that the output drives a
32
Ω
single-ended (SE) load. Again, no trace of output tran-
sients is seen.
USING THE LM4867 TO UPGRADE LM4863 AND LM4873
DESIGNS
The
LM4867’s
noise-free
operation
plus
coupling-capacitorless headphone operation and functional
compatibility with the LM4873 and the LM4863 simplifies
upgrading systems using these parts. Upgrading older de-
signs that use either the LM4863 or the LM4873 is easy.
Simply remove and short the coupling capacitors located
between the LM4873’s or LM4863’s Amp1A and Amp1B
outputs and the headphone connections. Also remove the
1k
Ω
resistor between each headphone connection and
ground. Finally, remove any resistors connected to the
HP-IN pin (typically two 100k
Ω
resistors). Connect the HP-IN
pin directly to the headphone jack control pin as shown in
Figure 4.
DS200013-56
FIGURE 2. Differential output signal (Trace B) is devoid
of transients. The SHUTDOWN pin is driven by a
shutdown signal (Trace A). The inverting output (Trace
C) and the non-inverting output (Trace D) are applied
across an 8
Ω
BTL load.
LM4867
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9
Application Information
(Continued)
The LM4867’s pin configuration simplifies the process of
upgrading systems that use the LM4863. Except for its four
MUX function pins, the LM4867’s pin configuration matches
the LM4863’s pin configuration. If the LM4867’s MUX func-
tionality is not needed when replacing an LM4863, connect
the MUX CTRL pin to either V
DD
or ground. To ensure
correct amplifier operation, unused MUX inputs must be
tied to GND. As shown in Table 1, grounding the MUX CTRL
pin selects stereo input 1 (−IN A1 and −IN B1), whereas
applying V
DD
to the MUX CTRL pin selects stereo input 2
(−IN A2 and −IN B2).
The LM4867’s unique headphone sense circuit requires a
dual switch headphone jack. Replace the four-terminal head-
phone jack used with the LM4863 and LM4873 with the
five-terminal headphone jack, such as the Switchcraft
35RAPC4BH3, shown in Figure 4. Connect the +OUT A
(Amp2A) pin to the five-terminal headphone jack’s sleeve
pin.
DS200013-57
FIGURE 3. Single-ended output signal (Trace B) is
devoid of transients. The SHUTDOWN pin is driven by
a shutdown signal (Trace A). The inverting output
(Trace C) and the V
BYPASS
output (Trace D) are applied
across a 32
Ω
BTL load.
DS200013-31
FIGURE 4. Typical Audio Amplifier Application Circuit
(Pin out shown for the 24-pin Exposed-DAP LLP package. Numbers in ( ) are for the 20-pin MTE and MT packages.)
LM4867
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10
Application Information
(Continued)
STEREO-INPUT MULTIPLEXER (STEREO MUX)
The LM4867 has two stereo inputs. The MUX CTRL Pin
controls which stereo input is active. As shown in the Truth
Table for Logic Inputs, applying 0V to the MUX CTRL input
activates stereo input 1, whereas applying V
DD
to the MUX
CTRL inputs activates stereo input 2. To ensure correct
amplifier operation, unused MUX inputs must be tied to
GND.
Typical LM4867 applications use the MUX to switch between
two stereo input signals. Each stereo channel’s gain can be
tailored to produce the required output signal level by choos-
ing the appropriate input and feedback resistor ratio.
Another configuration uses the MUX to select two different
gains or frequency compensated gains that amplify a single
pair of stereo input signals.
Figure 5 shows two different
feedback networks, Network 1 and Network 2. Network 1
produces increasing gain as the input signal’s frequency
decreases. This can be used to compensate a small,
full-range speaker’s low frequency response roll-off. Network
2 sets the gain for an alternate load such as headphones.
The circuit in
Figure 6 uses Network 1 when driving external
speakers, switching to Network 2 when headphones are
connected. The normally closed control switch in
Figure 6’s
headphone jack connects to the MUX CTRL pin. When
headphones are connected, the LM4867’s internal pull-up
that applies V
DD
to the HP-IN and the external 100k
Ω
resis-
tor applies V
DD
to MUX CTRL pin. Simultaneously applying
these control voltages automatically selects the amplifier
(headphone or bridge) and switches the gain (MUX channel
selection). Alternatively, leaving the MUX CTRL pin indepen-
dently accessible allows a user to select bass boost as
needed. This alternative user-selectable bass-boost scheme
requires connecting equal ratio resistor feedback networks
to each MUX input channel. The value of the resistor in the
RC network is chosen to give a gain that is necessary to
achieve the desired bass-boost.
Switching between the MUX channels may change the input
signal source or the feedback resistor network. During the
channel switching transition, the average voltage level
present on the internal amplifier’s input may change. This
change can slew at a rate that may produce audible voltage
transients or clicks in the amplifier’s output signal. Using the
MUX to select between two vastly dissimilar gains is a typical
transient-producing situation. As the MUX is switched, an
audible click may occur as the gain suddenly changes.
PIN OUT COMPATIBILITY WITH THE LM4863
The LM4867 pin out was designed to simplify replacing the
LM4863: except for the four Pins(-IN A
2
, MUX CTRL, -IN B
2
,
and NC) that implement the LM4867’s extra functionality, the
LM4867MT/MTE and LM4863MT/MTE pin outs match.
(Note 22)
Note 22: If the LM4867 replaces an LM4863 and the input MUX circuitry is
not being used, the LM4867 MUX CTRL pin must be tied to V
DD
or GND and
the unused MUX inputs must be connected to GND.
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4867’s exposed-DAP (die attach paddle) packages
(MTE and LQ) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surround-
ing PCB