Philips
Semiconductors
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
Product specification
Supersedes data of 1998 Jan 19
IC20 Data Handbook
1998 May 01
INTEGRATED CIRCUITS
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
2
1998 May 01
853-0599 19326
DESCRIPTION
The Philips 83C751/87C751 offers the advantages of the 80C51
architecture in a small package and at low cost.
The 8XC751 Microcontroller is fabricated with Philips high-density
CMOS technology. Philips epitaxial substrate minimizes CMOS
latch-up sensitivity.
The 8XC751 contains a 2k
×
8 ROM (83C751) EPROM (87C751), a
64
×
8 RAM, 19 I/O lines, a 16-bit auto-reload counter/timer, a
five-source, fixed-priority level interrupt structure, a bidirectional
inter-integrated circuit (I
2
C) serial bus interface, and an on-chip
oscillator.
The on-board inter-integrated circuit (I
2
C) bus interface allows the
8XC751 to operate as a master or slave device on the I
2
C small
area network. This capability facilitates I/O and RAM expansion,
access to EEPROM, processor-to-processor communication, and
efficient interface to a wide variety of dedicated I
2
C peripherals.
FEATURES
•
80C51 based architecture
•
Inter-Integrated Circuit (I
2
C) serial bus interface
•
Small package sizes
– 24-pin DIP (300 mil “skinny DIP”)
– 24-pin Shrink Small Outline Package
– 28-pin PLCC
•
87C751 available in one-time programmable plastic packages
•
Wide oscillator frequency range
•
Low power consumption:
– Normal operation: less than 11mA @ 5V, 12MHz
– Idle mode
– Power-down mode
•
2k
×
8 ROM (83C751)
2k
×
8 EPROM (87C751)
•
64
×
8 RAM
•
16-bit auto reloadable counter/timer
•
Fixed-rate timer
•
Boolean processor
•
CMOS and TTL compatible
•
Well suited for logic replacement, consumer and industrial
applications
•
LED drive outputs
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
P3.4/A4
P3.3/A3
P3.2/A2/A10
P3.1/A1/A9
P3.0/A0/A8
P0.2/V
PP
P0.1/SDA/OE–PGM
RST
X2
X1
V
SS
P0.0/SCL/ASEL
P1.0/D0
P1.1/D1
P1.2/D2
P1.3/D3
P1.4/D4
P1.5/INT0/D5
P1.6/INT1/D6
P1.7/T0/D7
P3.7/A7
P3.6/A6
P3.5/A5
V
CC
PLASTIC
DUAL
IN-LINE
PACKAGE
AND
SHRINK
SMALL
OUTLINE
PACKAGE
PLASTIC
LEADED
CHIP
CARRIER
4
1
26
5
11
25
19
12
18
Pin
Function
1
P3.4/A4
2
P3.3/A3
3
P3.2/A2/A10
4
P3.1/A1/A9
5
NC*
6
P3.0/A0/A8
7
P0.2/V
PP
8
P0.1/SDA/OE-PGM
9
P0.0//SCLASEL
SU00315
* DO NOT CONNECT
PinFunction
10
NC*
11
RST
12
X2
13
X1
14
V
SS
15
P1.0/D0
16
P1.1/D1
17
P1.2/D2
18
P1.3/D3
Pin
Function
19
P1.4/D4
20
P1.5/INT0/D5
21
NC*
22
NC*
23
P1.6/INT1/D6
24
P1.7/T0/D7
25
P3.7/A7
26
P3.6/A6
27
P3.5/A5
28
V
CC
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
3
ORDERING INFORMATION
ROM
EPROM
1
TEMPERATURE RANGE
°
C
AND PACKAGE
FREQUENCY
DRAWING
NUMBER
S83C751–1N24
S87C751–1N24
OTP
0 to +70, Plastic Dual In-line Package
3.5 to 12MHz
SOT222-1
S83C751–2N24
S87C751–2N24
OTP
–40 to +85, Plastic Dual In-line Package
3.5 to 12MHz
SOT222-1
S83C751–4N24
S87C751–4N24
OTP
0 to +70, Plastic Dual In-line Package
3.5 to 16MHz
SOT222-1
S83C751–5N24
S87C751–5N24
OTP
–40 to +85, Plastic Dual In-line Package
3.5 to 16MHz
SOT222-1
S83C751–1A28
S87C751–1A28
OTP
0 to +70, Plastic Leaded Chip Carrier
3.5 to 12MHz
SOT261-3
S83C751–2A28
S87C751–2A28
OTP
–40 to +85, Plastic Leaded Chip Carrier
3.5 to 12MHz
SOT261-3
S83C751–4A28
S87C751–4A28
OTP
0 to +70, Plastic Leaded Chip Carrier
3.5 to 16MHz
SOT261-3
S83C751–5A28
S87C751–5A28
OTP
–40 to +85, Plastic Leaded Chip Carrier
3.5 to 16MHz
SOT261-3
S83C751–1DB
S87C751–1DB
OTP
0 to +70, Shrink Small Outline Package
3.5 to 12MHz
SOT340-1
S83C751–4DB
S87C751–4DB
OTP
0 to +70, Shrink Small Outline Package
3.5 to 16MHz
SOT340-1
NOTE:
1. OTP = One Time Programmable EPROM.
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
4
BLOCK DIAGRAM
RST
X1
X2
VCC
VSS
RAM
ROM/
EPROM
ACC
TMP2
TMP1
ALU
INSTRUCTION
REGISTER
PD
OSCILLATOR
PSW
BUFFER
DPTR
PCON
I2CFG I2STA
TCON
I2DAT
I2CON
IE
TH0
TL0
RTH
RTL
INTERRUPT, SERIAL
PORT AND TIMER BLOCKS
I
2
C
CONTROL
P1.0–P1.7
P3.0–P3.7
P0.0–P0.2
PORT 0
DRIVERS
RAM ADDR
REGISTER
PORT 0
LATCH
STACK
POINTER
PROGRAM
ADDRESS
REGISTER
PC
INCRE-
MENTER
PROGRAM
COUNTER
PORT 3
DRIVERS
PORT 1
DRIVERS
PORT 3
LATCH
PORT 1
LATCH
TIMING
AND
CONTROL
B
REGISTER
SU00316
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
5
PIN DESCRIPTIONS
PIN NO.
MNEMONIC
DIP/
SSOP
LCC
TYPE
NAME AND FUNCTION
V
SS
12
14
I
Circuit Ground Potential
V
CC
24
28
I
Supply voltage during normal, idle, and power-down operation.
P0.0–P0.2
8–6
9–7
I/O
Port 0: Port 0 is a 3-bit open-drain, bidirectional port. Port 0 pins that have 1s written to them float,
and in that state can be used as high-impedance inputs. Port 0 also serves as the serial I
2
C
interface. When this feature is activated by software, SCL and SDA are driven low in accordance
with the I
2
C protocol. These pins are driven low if the port register bit is written with a 0 or if the I
2
C
subsystem presents a 0. The state of the pin can always be read from the port register by the
program.
To comply with the I
2
C specification, P0.0 and P0.1 are open drain bidirectional I/O pins with the
electrical characteristics listed in the tables that follow. While these differ from “standard TTL”
characteristics, they are close enough for the pins to still be used as general-purpose I/O in
non-I
2
C applications. Port 0 also provides alternate functions for programming the EPROM
memory as follows:
6
7
N/A
V
PP
(P0.2) – Programming voltage input. (See Note 1.)
7
8
I
OE/PGM (P0.1) – Input which specifies verify mode (output enable) or the program mode.
OE/PGM = 1 output enabled (verify mode).
OE/PGM = 0 program mode.
8
9
I
ASEL (P0.0) – Input which indicates which bits of the EPROM address are applied to port 3.
ASEL = 0 low address byte available on port 3.
ASEL = 1 high address byte available on port 3 (only the three least significant bits are used).
7
8
I/O
SDA (P0.1) – I
2
C data.
8
9
I/O
SCL (P0.0) – I
2
C clock.
P1.0–P1.7
13–20
15–20,
23, 24
I/O
Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. Port 1 pins that have 1s written
to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 1 pins
that are externally pulled low will source current because of the internal pull-ups. (See DC
Electrical Characteristics: I
IL
). Port 1 serves to output the addressed EPROM contents in the verify
mode and accepts as inputs the value to program into the selected address during the program
mode. Port 1 also serves the special function features of the 80C51 family as listed below:
18
20
I
INT0 (P1.5): External interrupt.
19
23
I
INT1 (P1.6): External interrupt.
20
24
I
T0 (P1.7): Timer 0 external input.
P3.0–P3.7
5–1,
23–21
6, 4–1,
27–25
I/O
Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. Port 3 pins that have 1s written
to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 3 pins
that are externally being pulled low will source current because of the pull-ups. (See DC Electrical
Characteristics: I
IL
). Port 3 also functions as the address input for the EPROM memory location to
be programmed (or verified). The 11-bit address is multiplexed into this port as specified by
P0.0/ASEL.
RST
9
11
I
Reset: A high on this pin for two machine cycles while the oscillator is running, resets the device.
An internal diffused resistor to V
SS
permits a power-on RESET using only an external capacitor to
V
CC
. After the device is reset, a 10-bit serial sequence, sent LSB first, applied to RESET, places
the device in the programming state allowing programming address, data and V
PP
to be applied for
programming or verification purposes. The RESET serial sequence must be synchronized with the
X1 input.
X1
11
13
I
Crystal 1: Input to the inverting oscillator amplifier and input to the internal clock generator circuits.
X1 also serves as the clock to strobe in a serial bit stream into RESET to place the device in the
programming state.
X2
10
12
O
Crystal 2: Output from the inverting oscillator amplifier.
NOTE:
1. When P0.2 is at or close to 0V it may affect the internal ROM operation. We recommend that P0.2 be tied to V
CC
via a small pullup
(e.g., 2k
Ω
).
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
6
ABSOLUTE MAXIMUM RATINGS
1, 2
PARAMETER
RATING
UNIT
Storage temperature range
–65 to +150
°
C
Voltage from V
CC
to V
SS
–0.5 to +6.5
V
Voltage from any pin to V
SS
(except V
PP
)
–0.5 to V
CC
+ 0.5
V
Power dissipation
1.0
W
Voltage on V
PP
pin to V
SS
0 to +13.0
V
Maximum I
OL
per I/O pin
10
mA
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section
of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
DC ELECTRICAL CHARACTERISTICS
T
amb
= 0
°
C to +70
°
C or –40
°
C to +85
°
C, V
CC
= 5V
±
10% for 87C751, V
CC
= 5V
±
10% for 83C751, V
SS
= 0V
1
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
IL
Input low voltage, except SDA, SCL
–0.5
0.2V
DD
–0.1
V
V
IH
Input high voltage, except X1, RST
0.2V
CC
+0.9
V
CC
+0.5
V
V
IH1
Input high voltage, X1, RST
0.7V
CC
V
CC
+0.5
V
SDA, SCL, P0.2
V
IL1
Input low voltage
–0.5
0.3V
CC
V
V
IH2
Input high voltage
0.7V
CC
V
CC
+0.5
V
V
OL
Output low voltage, ports 1 and 3
I
OL
= 1.6mA
2
0.45
V
V
OL1
Output low voltage, port 0.2
I
OL
= 3.2mA
2
0.45
V
V
OH
Output high voltage, ports 1 and 3
I
OH
= –60
µ
A
2.4
V
I
OH
= –25
µ
A
0.75V
CC
V
I
OH
= –10
µ
A
0.9V
CC
V
Port 0.0 and 0.1 (I
2
C) – Drivers
V
OL2
Output low voltage
I
OL
= 3mA
0.4
V
Driver, receiver combined:
(over V
CC
range)
C
Capacitance
10
pF
I
IL
Logical 0 input current, ports 1 and 3
V
IN
= 0.45V
–50
µ
A
I
TL
Logical 1 to 0 transition current, ports 1 and 3
3
V
IN
= 2V (0 to 70
°
C)
V
IN
= 2V (–40 to +85
°
C)
–650
–750
µ
A
µ
A
I
LI
Input leakage current, port 0
0.45 < V
IN
< V
CC
±
10
µ
A
R
RST
Internal pull-down resistor
25
175
k
Ω
C
IO
Pin capacitance
Test freq = 1MHz,
T
amb
= 25
°
C
10
pF
I
PD
Power-down current
4
V
CC
= 2 to V
CC
max
50
µ
A
V
PP
V
PP
program voltage (for 87C751 only)
V
SS
= 0V
V
CC
= 5V
±
10%
T
amb
= 21
°
C to 27
°
C
12.5
13.0
V
I
PP
Program current (for 87C751 only)
V
PP
= 13.0V
50
mA
I
CC
Supply current (see Figure 2)
NOTES TO DC ELECTRICAL CHARACTERISTICS ON NEXT PAGE.
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
7
NOTES TO DC ELECTRICAL CHARACTERISTICS:
1. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless otherwise
noted.
2. Under steady state (non-transient) conditions, I
OL
must be externally limited as follows:
Maximum I
OL
per port pin:
10mA
(NOTE: This is 85
°
C spec.)
Maximum I
OL
per 8-bit port:
26mA
Maximum total I
OL
for all outputs:
67mA
If I
OL
exceeds the test condition, V
OL
may exceed the related specification. Pins are not guaranteed to sink current greater than the listed
test conditions.
3. Pins of ports 1 and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its
maximum value when V
IN
is approximately 2V.
4. Power-down I
CC
is measured with all output pins disconnected; port 0 = V
CC
; X2, X1 n.c.; RST = V
SS
.
5. Active I
CC
is measured with all output pins disconnected; X1 driven with t
CLCH
, t
CHCL
= 5ns, V
IL
= V
SS
+ 0.5V, V
IH
= V
CC
– 0.5V; X2 n.c.;
RST = port 0 = V
CC
. I
CC
will be slightly higher if a crystal oscillator is used.
6. Idle I
CC
is measured with all output pins disconnected; X1 driven with t
CLCH
, t
CHCL
= 5ns, V
IL
= V
SS
+ 0.5V, V
IH
= V
CC
– 0.5V; X2 n.c.;
port 0 = V
CC
; RST = V
SS
.
AC ELECTRICAL CHARACTERISTICS
T
amb
= 0
°
C to +70
°
C or –40
°
C to +85
°
C, V
CC
= 5V
±
10% for 87C751, V
CC
= 5V
±
10% for 83C751, V
SS
= 0V
1, 2
12MHz CLOCK
VARIABLE CLOCK
SYMBOL
PARAMETER
MIN
MAX
MIN
MAX
UNIT
1/t
CLCL
Oscillator frequency:
3.5
12
MHz
3.5
16
MHz
External Clock (Figure 1)
t
CHCX
High time
20
20
ns
t
CLCX
Low time
20
20
ns
t
CLCH
Rise time
20
20
ns
t
CHCL
Fall time
20
20
ns
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless otherwise
noted.
2. Load capacitance for ports = 80pF.
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
8
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has five characters. The first character is always
‘t’ (= time). The other characters, depending on their positions,
indicate the name of a signal or the logical status of that signal. The
designations are:
C –
Clock
D –
Input data
H –
Logic level high
L
–
Logic level low
Q –
Output data
T –
Time
V –
Valid
X –
No longer a valid logic level
Z –
Float
t
CHCL
t
CLCL
t
CLCH
t
CHCX
V
CC
–0.5
0.45V
0.2 V
CC
+ 0.9
0.2 V
CC
– 0.1
t
CLCX
SU00297
Figure 1. External Clock Drive
4MHz
8MHz
12MHz
16MHz
FREQ
MAX ACTIVE ICC
5
TYP ACTIVE ICC
5
MAX IDLE ICC
6
TYP IDLE ICC
6
ICC (mA)
2
4
6
8
10
12
14
16
18
20
22
SU00298
Figure 2. I
CC
vs. FREQ
Maximum I
CC
values taken at V
CC
max and worst case temperature.
Typical I
CC
values taken at V
CC
= 5.0V and 25
°
C.
Notes 5 and 6 refer to DC Electrical Characteristics.
Philips Semiconductors
Product specification
83C751/87C751
80C51 8-bit microcontroller family
2K/64 OTP/ROM, I
2
C, low pin count
1998 May 01
9
OSCILLATOR CHARACTERISTICS
X1 and X2 are the input and output, respectively, of an inverting
amplifier which can be configured for use as an on-chip oscillator.
To drive the device from an external clock source, X1 should be
driven while X2 is left unconnected. There are no requirements on
the duty cycle of the external clock signal, because the input to the
internal clock circuitry is through a divide-by-two flip-flop. However,
minimum and maximum high and low times specified in the data
sheet must be observed.
RESET
A reset is accomplished by holding the RST pin high for at least two
machine cycles (24 oscillator periods), while the oscillator is running.
To insure a good power-up reset, the RST pin must be high long
enough to allow the oscillator time to start up (normally a few
milliseconds) plus two machine cycles. At power-up, the voltage on
V
CC
and RST must come up at the same time for a proper start-up.
IDLE MODE
In idle mode, the CPU puts itself to sleep while all of the on-chip
peripherals stay active. The instruction to invoke the idle mode is the
last instruction executed in the normal operating mode before the
idle mode is activated. The CPU contents, the on-chip RAM, and all
of the special function registers remain intact during this mode. The
idle mode can be terminated either by any enabled interrupt (at
which time the process is picked up at the interrupt service routine
and continued), or by a hardware reset which starts the processor in
the same manner as a power-on reset.
POWER-DOWN MODE
In the power-down mode, the oscillator is stopped and the
instruction to invoke power-down is the last instruction executed.
Only the contents of the on-chip RAM are preserved. A hardware
reset is the only way to terminate the power-down mode. the control
bits for the reduced power modes are in the special function register
PCON.
Table 1.
External Pin Status During Idle and
Power-Down Modes
MODE
Port 0
Port 1
Port 2
Idle
Data
Data
Data
Power-down
Data
Data
Data
DIFFERENCES BETWEEN THE 8XC751 AND THE
80C51
Memory Organization
The central processing unit (CPU) manipulates operands in two
address spaces as shown in Figure 3. The part’s internal memory
space consists of 2k bytes of program memory, and 64 bytes of data
RAM overlapped with the 128-byte special function register area.
The differences from the 80C51 are in RAM size (64 bytes vs. 128
bytes), in external RAM access (not available on the 83C751), in
internal ROM size (2k bytes vs. 4k bytes), and in external program