LH5496/96H
CMOS 512
×
9 FIFO
FEATURES
••
Fast Access Times:
15 */20/25/35/50/65/80 ns
••
Full CMOS Dual Port Memory Array
••
Fully Asynchronous Read and Write
••
Expandable-in Width and Depth
••
Full, Half-Full, and Empty Status Flags
••
Read Retransmit Capability
••
TTL Compatible I/O
••
Packages:
28-Pin, 300-mil PDIP
28-Pin, 600-mil PDIP
32-Pin PLCC
••
Pin and Functionally Compatible with IDT7201
FUNCTIONAL DESCRIPTION
The LH5496/96H are dual port memories with internal
addressing to implement a First-In, First-Out algorithm.
Through an advanced dual port architecture, they provide
fully asynchronous read/write operation. Empty, Full, and
Half-Full status flags are provided to prevent data over-
flow and underflow. In addition, internal logic provides for
unlimited expansion in both word size and depth.
Read and write operations automatically access se-
quential locations in memory in that data is read out in the
same order that it was written, that is on a First-In,
First-Out basis. Since the address sequence is internally
predefined, no external address information is required
for the operation of this device. A ninth data bit is provided
for parity or control information often needed in commu-
nication applications.
Empty, Full, and Half-Full status flags monitor the
extent to which data has been written into the FIFO, and
prevent improper operations (i.e., Read if the FIFO is
empty, or Write if the FIFO is full). A retransmit feature
resets the Read address pointer to its initial position,
thereby allowing repetitive readout of the same data.
Expansion In and Expansion Out pins implement an
expansion scheme that allows individual FIFOs to be
cascaded to greater depth without incurring additional
latency (bubblethrough) delays.
PIN CONNECTIONS
5496-1D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
W
D
8
D
3
D
2
D
1
D
0
XI
FF
Q
0
V
SS
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
D
4
FL/RT
RS
EF
XO/HF
R
Q
1
Q
2
Q
3
Q
8
D
6
D
5
D
7
Q
7
Q
6
Q
5
Q
4
28-PIN PDIP
TOP VIEW
Figure 1. Pin Connections for PDIP Packages
5
6
7
8
9
10
D
2
D
1
D
0
XI
FF
Q
0
11
Q
1
2
3
4
32 31 30
29
28
27
26
25
24
D
6
D
7
NC
EF
D
3
D
8
W
NC
V
CC
D
4
D
5
14 15 16
20
19
18
17
FL/RT
RS
23
XO/HF
22
Q
7
21
Q
6
12
NC
13
Q
2
1
Q
3
Q
8
V
SS
NC
R
Q
4
Q
5
5496-2D
32-PIN PLCC
TOP VIEW
Figure 2. Pin Connections for PLCC Package
* LH5496 only.
1
PIN DESCRIPTIONS
PIN
PIN TYPE *
DESCRIPTION
D
0
– D
8
I
Input Data Bus
Q
0
– Q
8
O/Z
Output Data Bus
W
I
Write Request
R
I
Read Request
EF
O
Empty Flag
FF
O
Full Flag
* I = Input, O = Output, Z = High-Impedance, V = Power Voltage Level
PIN
PIN TYPE *
DESCRIPTION
XO/HF
O
Expansion Out/Half-Full Flag
XI
I
Expansion In
FL/RT
I
First Load/Retransmit
RS
I
Reset
V
CC
V
Positive Power Supply
V
SS
V
Ground
DATA OUTPUTS
Q
0
- Q
8
FLAG
LOGIC
WRITE
POINTER
READ
POINTER
DATA INPUTS
D
0
- D
8
DUAL-PORT
RAM
ARRAY
512 x 9
EF
FF
. . .
5496-3
INPUT
PORT
CONTROL
R
W
RESET
LOGIC
RS
OUTPUT
PORT
CONTROL
EXPANSION
LOGIC
XO/HF
XI
FL/RT
Figure 3. LH5496/96H Block Diagram
LH5496/96H
CMOS 512
×
9 FIFO
2
ABSOLUTE MAXIMUM RATINGS
1
PARAMETER
RATING
Supply Voltage to V
SS
Potential
–0.5 V to 7 V
Signal Pin Voltage to V
SS
Potential
3
–0.5 V to V
CC
+ 0.5 V (not to exceed 7 V)
DC Output Current
2
±
50 mA
Storage Temperature Range
–65
o
C to 150
o
C
Power Dissipation (Package Limit)
1.0 W
DC Voltage Applied To Outputs In High-Z State
–0.5 V to Vcc + 0.5 V (not to exceed 7 V)
NOTES:
1.
Stresses greater than those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device.
This is a device stress rating for transient conditions only. Functional operation at these or any other conditions above
those indicated in the ‘Operating Range’ of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2.
Outputs should not be shorted for more than 30 seconds. No more than one output should be shorted at any time.
3.
Negative undershoots of 1.5 V in amplitude are permitted for up to 10 ns once per cycle.
OPERATING RANGE
SYMBOL
PARAMETER
MIN
MAX
UNIT
T
A
Temperature, Ambient, LH5496
0
70
o
C
T
A
Temperature, Ambient, LH5496H
– 40
85
o
C
V
CC
Supply Voltage
4.5
5.5
V
V
SS
Supply Voltage
0
0
V
V
IL
Logic ‘0’ Input Voltage
1
–0 .5
0.8
V
V
IH
Logic ‘1’ Input Voltage
2.0
V
CC
+ 0.5
V
NOTE:
1.
Negative undershoots of 1.5 V in amplitude are permitted for up to 10 ns once per cycle.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
I
LI
Input Leakage Current
V
CC
= 5.5 V, V
IN
= 0 V to V
CC
–10
10
µ
A
I
LO
Output Leakage Current
R
≥
V
IH
, 0 V
≤
V
OUT
≤
V
CC
–10
10
µ
A
V
OH
Output High Voltage
I
OH
= –2.0 mA
2.4
V
V
OL
Output Low Voltage
I
OL
= 8.0 mA
0.4
V
I
CC
Average Supply Current
1
Measured at f = 40 MHz
100
mA
I
CC2
Average Standby Current
1
All Inputs = V
IH
15
mA
I
CC3
Power Down Current
1
All Inputs = V
CC
– 0.2 V
5
mA
NOTE:
1.
I
CC
, I
CC2
, and I
CC3
are dependent upon actual output loading and cycle rates. Specified values are with outputs open.
CMOS 512
×
9 FIFO
LH5496/96H
3
AC TEST CONDITIONS
PARAMETER
RATING
Input Pulse Levels
V
SS
to 3 V
Input Rise and Fall Times (10% to 90%)
5 ns
Input Timing Reference Levels
1.5 V
Output Reference Levels
1.5 V
Output Load, Timing Tests
Figure 4
CAPACITANCE
1,2
PARAMETER
RATING
C
IN
(Input Capacitance)
5 pF
C
OUT
(Output Capacitance)
7 pF
NOTES:
1.
Sample tested only.
2.
Capacitances are maximum values at 25
o
C measured at 1.0 MHz
with V
IN
= 0 V.
5496-4
DEVICE
UNDER
TEST
+5 V
30 pF
1.1 k
Ω
680
Ω
INCLUDES JIG & SCOPE CAPACITANCES
*
*
Figure 4. Output Load Circuit
LH5496/96H
CMOS 512
×
9 FIFO
4
AC ELECTRICAL CHARACTERISTICS
1
(Over Operating Range)
SYMBOL
PARAMETER
t
A
= 15 ns
2
t
A
= 20 ns t
A
= 25 ns t
A
= 35 ns t
A
= 50 ns t
A
= 65 ns
t
A
= 80 ns
UNIT
MIN
MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN
MAX
MIN MAX
READ CYCLE TIMING
t
RC
Read
Cycle
Time
25
–
30
– 35
– 45
–
65
– 80
–
100
–
ns
t
A
Access Time
–
15
–
20
–
25
–
35
–
50
–
65
–
80
ns
t
RR
Read
Recover
Time
10
–
10
– 10
–
10
–
15
– 15
–
15
–
ns
t
RPW
Read Pulse Width
3
15
–
20 – 25
–
35
–
50
– 65
–
80
–
ns
t
RLZ
Data Bus Active from Read LOW
4
5
–
5
–
5
–
5
–
5
–
5
–
10
–
ns
t
WLZ
Data Bus Active from Write
HIGH
4,5
10
–
10
– 10
–
10
–
10
– 10
–
20
–
ns
t
DV
Data Valid from Read Pulse HIGH
5
–
5
–
5
–
5
–
5
–
5
–
5
–
ns
t
RHZ
Data Bus High-Z from Read
HIGH
4
–
15
–
15
–
15
–
15
–
20
–
30
–
30
ns
WRITE CYCLE TIMING
t
WC
Write Cycle Time
25
–
30
–
35
–
45
–
65
–
80
–
100
–
ns
t
WPW
Write Pulse Width
3
15
–
20
– 25
–
35
–
50
–
65
– 80
–
ns
t
WR
Write
Recovery
Time
10
–
10
– 10
–
10
–
15
–
15
– 15
–
ns
t
DS
Data Setup Time
10
–
10
–
10
–
15
–
20
–
20
–
20
–
ns
t
DH
Data
Hold
Time
0
–
0
– 0
–
0
–
0
–
5
– 5
–
ns
RESET TIMING
t
RSC
Reset Cycle Time
25
–
30
–
35
–
45
–
65
–
80
–
100
–
ns
t
RS
Reset Pulse Width
3
15
–
20
– 25
–
35
–
50
–
65
–
80
–
ns
t
RSR
Reset Recovery Time
10
–
10
–
10
–
10
–
15
–
15
–
15
–
ns
t
RRSS
Read HIGH to RS HIGH
15
–
20
–
25
–
35
–
50
–
65
–
80
–
ns
t
WRSS
Write HIGH to RS HIGH
15
–
20
–
25
–
35
–
50
–
65
–
80
–
ns
RETRANSMIT TIMING
t
RTC
Retransmit Cycle Time
25
–
30
– 35
– 45
–
65
–
80
–
100
–
ns
t
RT
Retransmit Pulse Width
3
15
–
20
– 25
– 35
–
50
–
65
–
80
–
ns
t
RTR
Retransmit
Recovery
Time
10
–
10
– 10
– 10
–
15
–
15
–
15
–
ns
FLAG TIMING
t
EFL
Reset LOW to Empty Flag LOW
–
25
–
30
–
35
–
45
–
65
–
80
–
100
ns
t
HFH,FFH
Reset LOW to Half-Full and Full
Flags HIGH
–
25
–
30
–
35
–
45
–
65
–
80
–
100
ns
t
REF
Read LOW to Empty Flag LOW
–
20
–
25
–
25
–
35
–
45
–
60
–
60
ns
t
RFF
Read HIGH to Full Flag HIGH
–
20
–
25
–
25
–
35
–
45
–
60
–
60
ns
t
WEF
Write HIGH to Empty Flag HIGH
–
20
–
25
–
25
–
35
–
45
–
60
–
60
ns
t
WFF
Write LOW to Full Flag LOW
–
20
–
25
–
25
–
35
–
45
–
60
–
60
ns
t
WHF
Write LOW to Half-Full Flag LOW
–
25
–
30
–
35
–
45
–
65
–
80
–
100
ns
t
RHF
Read HIGH to Half-Full Flag HIGH
–
25
–
30
–
35
–
45
–
65
–
80
–
100
ns
EXPANSION TIMING
t
XOL
Expansion Out LOW
–
18
–
20
–
25
–
35
–
50
–
65
–
80
ns
t
XOH
Expansion Out HIGH
–
18
–
20
–
25
–
35
–
50
–
65
–
80
ns
t
XI
Expansion In Pulse Width
15
–
20
–
25
–
35
–
50
–
65
–
80
–
ns
t
XIR
Expansion In Recovery Time
10
–
10
–
10
–
10
–
10
–
10
–
10
–
ns
t
XIS
Expansion in Setup Time
7
–
10
–
10
–
15
–
15
–
15
–
15
–
ns
NOTES:
1.
LH5496 only.
2.
All timing measurements performed at ‘AC Test Condition’ levels.
CMOS 512
×
9 FIFO
LH5496/96H
5
OPERATIONAL DESCRIPTION
Reset
The device is reset whenever the Reset pin (RS) is
taken to a LOW state. The reset operation initializes both
the read and write address pointers to the first memory
location. The XI and FL pins are also sampled at this time
to determine whether the device is in Single mode or
Depth Expansion mode. A reset pulse is required when
the device is first powered up. The Read (R) and Write
(W) pins may be in any state when reset is initiated, but
must be brought to a HIGH state t
RPW
and t
WPW
before
the rising edge of RS. The reset operation forces the
Empty Flag EF to be asserted (EF = LOW), and the
Half-Full Flag HF and the Full FLag FF to be deasserted
(HF = FF = HIGH); the Data Out pins (D
0
– D
8
) are forced
into a high-impedance state.
Write
A write cycle is initiated on the falling edge of the Write
(W) pin. Data setup and hold times must be observed on
the data in (D
0
– D
8
) pins. A write operation is only possible
if the FIFO is not full, (i.e. the Full flag pin is HIGH). Writes
may occur independently of any ongoing read operta-
tions.
At the falling edge of the first write after the memory is
half filled, the Half-Full flag will be asserted (HF = LOW)
and will remain asserted until the difference between the
write pointer and read pointer indicates that the remaining
data in the device is less than or equal to one half the total
capacity of the FIFO. The Half-Full flag is deasserted
(HF = HIGH) by the appropriate rising edge of R.
The Full flag is asserted (FF = LOW) at the falling edge
of the write operation which fills the last available location
in the FIFO memory array. The Full flag will inhibit further
writes until cleared by a valid read. The Full flag is
deasserted (FF = HIGH) after the next rising edge of R
releases another memory location.