E
PRELIMINARY
July 1997
Order Number: 290530-005
n
Intel SmartVoltage Technology
5V or 12V Program/Erase
2.7V, 3.3V or 5V Read Operation
Increased Programming Throughput
at 12V V
PP
n
Very High-Performance Read
5V: 60/80/120 ns Max. Access Time,
30/40 ns Max. Output Enable Time
3V: 110/150/180 ns Max Access
65/90 ns Max. Output Enable Time
2.7V: 120 ns Max Access 65 ns Max.
Output Enable Time
n
Low Power Consumption
Max 60 mA Read Current at 5V
Max 30 mA Read Current at
2.7V–3.6V
n
x8/x16-Selectable Input/Output Bus
28F400 for High Performance 16- or
32-bit CPUs
n
x8-Only Input/Output Architecture
28F004B for Space-Constrained
8-bit Applications
n
Optimized Array Blocking Architecture
One 16-KB Protected Boot Block
Two 8-KB Parameter Blocks
One 96-KB Main Block
Three 128-KB Main Blocks
Top or Bottom Boot Locations
n
Absolute Hardware-Protection for Boot
Block
n
Software EEPROM Emulation with
Parameter Blocks
n
Extended Temperature Operation
–40°C to +85°C
n
Extended Cycling Capability
100,000 Block Erase Cycles
(Commercial Temperature)
10,000 Block Erase Cycles
(Extended Temperature)
n
Automated Word/Byte Program and
Block Erase
Industry-Standard Command User
Interface
Status Registers
Erase Suspend Capability
n
SRAM-Compatible Write Interface
n
Automatic Power Savings Feature
1 mA Typical I
CC
Active Current in
Static Operation
n
Reset/Deep Power-Down Input
0.2 µA I
CC
Typical
Provides Reset for Boot Operations
n
Hardware Data Protection Feature
Write Lockout during Power
Transitions
n
Industry-Standard Surface Mount
Packaging
40-Lead TSOP
44-Lead PSOP: JEDEC ROM
Compatible
48-Lead TSOP
56-Lead TSOP
n
Footprint Upgradeable from 2-Mbit and
to 8-Mbit Boot Block Flash Memories
n
ETOX™ IV Flash Technology
4-MBIT (256K X 16, 512K X 8)
SmartVoltage BOOT BLOCK FLASH
MEMORY FAMILY
28F400BV-T/B, 28F400CV-T/B, 28F004BV-T/B
28F400CE-T/B, 28F004BE-T/B
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F400BV-T/B, 28F400CV-T/B, 28F004BV-T/B, 28F400CE-T/B, 28F004BE-T/B may contain design defects or errors
known as errata which may cause the product to deviate from published specifications. Current characterized errata are
available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 7641
Mt. Prospect, IL 60056-7641
or call 1-800-879-4683
or visit Intel’s Website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION, 1997
CG-041493
*
Third-party brands and names are the property of their respective owners.
E
4-MBIT SmartVoltage BOOT BLOCK FAMILY
3
PRELIMINARY
CONTENTS
PAGE
PAGE
1.0 PRODUCT FAMILY OVERVIEW .................... 5
1.1 New Features in the SmartVoltage
Products ..................................................... 5
1.2 Main Features.............................................. 5
1.3 Applications ................................................. 7
1.4 Pinouts......................................................... 7
1.5 Pin Descriptions ......................................... 11
2.0 PRODUCT DESCRIPTION............................ 13
2.1 Memory Blocking Organization .................. 13
2.1.1 Boot Block........................................... 13
2.1.2 Parameter Blocks................................ 13
2.1.3 Main Blocks......................................... 13
3.0 PRODUCT FAMILY PRINCIPLES OF
OPERATION ................................................ 15
3.1 Bus Operations .......................................... 15
3.2 Read Operations........................................ 15
3.2.1 Read Array.......................................... 15
3.2.2 Intelligent Identifiers ............................ 17
3.3 Write Operations ........................................ 17
3.3.1 Command User Interface (CUI) ........... 17
3.3.2 Status Register ................................... 20
3.3.3 Program Mode .................................... 21
3.3.4 Erase Mode......................................... 21
3.4 Boot Block Locking .................................... 22
3.4.1 V
PP
= V
IL
for Complete Protection ....... 22
3.4.2 WP# = V
IL
for Boot Block Locking ....... 22
3.4.3 RP# = V
HH
or WP# = V
IH
forr Boot Block
Unlocking ........................................... 22
3.4.4 Upgrade Note for 8-Mbit 44-PSOP
Package............................................. 22
3.5 Power Consumption................................... 26
3.5.1 Active Power ....................................... 26
3.5.2 Automatic Power Savings (APS) ......... 26
3.5.3 Standby Power .................................... 26
3.5.4 Deep Power-Down Mode..................... 26
3.6 Power-Up/Down Operation......................... 26
3.6.1 RP# Connected to System Reset ........ 26
3.6.2 V
CC
, V
PP
and RP# Transitions ............. 27
3.7 Power Supply Decoupling .......................... 27
3.7.1 V
PP
Trace on Printed Circuit Boards.... 27
4.0 ABSOLUTE MAXIMUM RATINGS................ 28
5.0 COMMERCIAL OPERATING CONDITIONS . 29
5.1 Applying V
CC
Voltages ............................... 29
5.2 DC Characteristics ..................................... 30
5.3 AC Characteristics ..................................... 34
6.0 EXTENDED OPERATING CONDITIONS ...... 44
6.1 Applying V
CC
Voltages ............................... 44
6.2 DC Characteristics ..................................... 45
6.3 AC Characteristics ..................................... 51
APENDIX A: Additional Information ................. 56
APPENDIX B: Additional Information............... 57
4-MBIT SmartVoltage BOOT BLOCK FAMILY
E
4
PRELIMINARY
REVISION HISTORY
Number
Description
-001
Initial release of datasheet.
-002
Status changed from Product Preview to Preliminary
28F400CV/CE/BE references and information added throughout.
2.7V CE/BE specs added throughout.
The following sections have been changed or rewritten: 1.1, 3.0, 3.2.1, 3.2.2, 3.3.1,
3.3.1.1, 3.3.2, 3.3.2.1, 3.3.3, 3.3.4, 3.6.2.
Note 2 added to Figure 3 to clarify 28F008B pinout vs. 28F008SA.
Sentence about program and erase WSM timeout deleted from Section 3.3.3, 3.3.4.
Erroneous arrows leading out of error states deleted from flowcharts in Figs. 9, 10.
Sections 5.1, 6.1 changed to “Applying V
CC
Voltages.” These sections completely
changed to clarify V
CC
ramp requirements.
I
PPD
3.3V Commercial spec changed from 10 to 5
µ
A.
Capacitance tables added after commercial and extended DC Characteristics tables.
Test and slew rate notes added to Figs. 12, 13, 19, 20, 21.
Test configuration drawings (Fig. 14, 22) consolidated into one, with component
values in table. (Component values also rounded off).
t
ELFL
, t
ELFH
, t
AVFL
changed from 7 to 5 ns for 3.3V BV-60 commercial and 3.3V
TBV-80 extended, 10 to 5 ns for 3.3V BV-80 and BV-120 commercial.
t
WHAX
and t
EHAX
changed from 10 to 0 ns.
t
PHWL
changed from 1000 ns to 800 ns for 3.3V BV-80, BV-120 commercial.
t
PHEL
changed from 1000 ns to 800 ns for 3.3V BV-60, BV-80, and BV-120 commercial.
-003
28F400BE row removed from Table 1
Applying V
CC
voltages (Sections 5.1 and 6.1) rewritten for clarity.
Minor cosmetic changes/edits.
-004
Corrections: Spec typographical error “t
QWL
” corrected to read “t
QVVL
.”
Intel386™ EX Microprocessor block diagram updated because latest Intel386 CPU
specs require less glue logic.
Spec t
ELFL
and t
ELFH
changed from 5 ns (max) to 0 ns (min).
New specs t
PLPH
and t
PLQX
added from Specification Update document (297595).
Specs t
EHQZ
and t
GHQZ
improved on most voltage/speed combinations.
-005
Correction: Appendix A, Ordering information fixed order numbers from TE27F400BVT80
to TE28F400BVT80 and TE27F400BVB80 to TE28F400BVB80.
Updated disclaimer.
E
4-MBIT SmartVoltage BOOT BLOCK FAMILY
5
PRELIMINARY
1.0
PRODUCT FAMILY OVERVIEW
This datasheet contains the specifications for the
two branches of products in the SmartVoltage
4-Mbit boot block flash memory family: the -BE/CE
suffix products feature a low V
CC
operating range
of 2.7V–3.6V; the -BV/CV suffix products offer
3.0V–3.6V operation. Both BE/CE and BV/CV
products also operate at 5V for high-speed access
times. Throughout this datasheet, the 28F400
refers to all x8/x16 4-Mbit products, while
28F004B refers to all x8 4-Mbit boot block
products. Also, the term “2.7V” generally refers to
the full voltage range 2.7V–3.6V. Section 1
provides an overview of the flash memory family
including applications, pinouts and pin
descriptions. Sections 2 and 3 describe the
memory organization and operation for these
products. Finally, Sections 4 and 5 contain the
family’s operating specifications.
1.1
New Features in the
SmartVoltage Products
The SmartVoltage boot block flash memory family
offers identical operation with the BX/BL 12V
program products, except for the differences listed
below. All other functions are equivalent to current
products, including signatures, write commands,
and pinouts.
•
WP# pin has replaced a DU (Don’t Use) pin.
Connect the WP# pin to control signal or to
V
CC
or GND (in this case, a logic-level signal
can be placed on DU pin). See Tables 2 and
9 to see how the WP# pin works.
•
5V program/erase operation has been added.
If switching V
PP
for write protection, switch to
GND (not 5V) for complete write protection. To
take advantage of 5V write-capability, allow for
connecting 5V to V
PP
and disconnecting 12V
from V
PP
line.
•
Enhanced circuits optimize low V
CC
performance, allowing operation down to
V
CC
= 2.7V (using the BE product).
If you are using BX/BL 12V V
PP
boot block
products today, you should account for the
differences listed above and also allow for
connecting 5V to V
PP
and disconnecting 12V from
V
PP
line, if 5V writes are desired.
1.2
Main Features
Intel’s SmartVoltage technology is the most
flexible voltage solution in the flash industry,
providing two discrete voltage supply pins: V
CC
for
read operation, and V
PP
for program and erase
operation. Discrete supply pins allow system
designers to use the optimal voltage levels for
their design. The 28F400BV/CV, 28F004BV,
28F400CE and 28F004BE provide program/erase
capability at 5V or 12V. The 28F400BV/CV and
28F004BV allow reads with V
CC
at 3.3
±
0.3V or
5V, while the 28F400CE and 28F004BE allow
reads with V
CC
at 2.7V–3.6V or 5V. Since many
designs read from the flash memory a large
percentage of the time, read operation using the
2.7V or 3.3V ranges can provide great power
savings. If read performance is an issue, however,
5V V
CC
provides faster read access times.
Table 1. SmartVoltage Provides Total Voltage Flexibility
Product
Bus
V
CC
V
PP
Name
Width
2.7V–3.6V
3.3
±
0.3V
5V
±
5%
5V
±
10%
5V
±
10%
12V
±
5%
28F004BV-T/B
x8
√
√
√
√
28F400BV-T/B
x8 or x16
√
√
√
√
28F400CV-T/B
x8 or x16
√
√
√
√
28F004BE-T/B
x8
√
√
√
√
28F400CE-T/B
x8 or x16
√
√
√
√
4-MBIT SmartVoltage BOOT BLOCK FAMILY
E
6
PRELIMINARY
For program and erase operations, 5V V
PP
operation eliminates the need for in system voltage
converters, while 12V V
PP
operation provides faster
program and erase for situations where 12V is
available, such as manufacturing or designs where
12V is in-system. For design simplicity, however,
just hook up V
CC
and V
PP
to the same 5V ± 10%
source.
The 28F400/28F004B boot block flash memory
family is a high-performance, 4-Mbit (4,194,304 bit)
flash memory family organized as either
256 Kwords of 16 bits each (28F400 only) or
512 Kbytes of 8 bits each (28F400 and 28F004B).
Separately erasable blocks, including a hardware-
lockable boot block (16,384 bytes), two parameter
blocks (8,192 bytes each) and main blocks (one
block of 98,304 bytes and three blocks of 131,072
bytes), define the boot block flash family
architecture. See Figures 7 and 8 for memory
maps. Each block can be independently erased and
programmed 100,000 times at commercial
temperature or 10,000 times at extended
temperature.
The boot block is located at either the top (denoted
by -T suffix) or the bottom (-B suffix) of the address
map in order to accommodate different
microprocessor protocols for boot code location.
The hardware-lockable boot block provides
complete code security for the kernel code required
for system initialization. Locking and unlocking of
the boot block is controlled by WP# and/or RP#
(see Section 3.4 for details).
The Command User Interface (CUI) serves as the
interface between the microprocessor or
microcontroller and the internal operation of the
boot block flash memory products. The internal
Write State Machine (WSM) automatically executes
the algorithms and timings necessary for program
and erase operations, including verifications,
thereby unburdening the microprocessor or
microcontroller of these tasks. The Status Register
(SR) indicates the status of the WSM and whether it
successfully completed the desired program or
erase operation.
Program and Erase Automation allows program and
erase operations to be executed using an industry-
standard two-write command sequence to the CUI.
Data writes are performed in word (28F400 family)
or byte (28F400 or 28F004B families) increments.
Each byte or word in the flash memory can be
programmed independently of other memory
locations, unlike erases, which erase all locations
within a block simultaneously.
The 4-Mbit SmartVoltage boot block flash memory
family is also designed with an Automatic Power
Savings (APS) feature which minimizes system
battery current drain, allowing for very low power
designs. To provide even greater power savings,
the boot block family includes a deep power-down
mode which minimizes power consumption by
turning most of the flash memory’s circuitry off.
This mode is controlled by the RP# pin and its
usage is discussed in Section 3.5, along with other
power consumption issues.
Additionally, the RP# pin provides protection
against unwanted command writes due to invalid
system bus conditions that may occur during
system reset and power-up/down sequences. For
example, when the flash memory powers-up, it
automatically defaults to the read array mode, but
during a warm system reset, where power
continues uninterrupted to the system components,
the flash memory could remain in a non-read mode,
such as erase. Consequently, the system Reset
signal should be tied to RP# to reset the memory to
normal read mode upon activation of the Reset
signal. See Section 3.6.
The 28F400 provides both byte-wide or word-wide
input/output, which is controlled by the BYTE# pin.
Please see Table 2 and Figure 16 for a detailed
description of BYTE# operations, especially the
usage of the DQ
15
/A
–1
pin.
The 28F400 products are available in a
ROM/EPROM-compatible pinout and housed in the
44-lead PSOP (Plastic Small Outline) package, the
48-lead TSOP (Thin Small Outline, 1.2 mm thick)
package and the 56-lead TSOP as shown in
Figures
4, 5 and
6, respectively. The 28F004
products are available in the 40-lead TSOP
package as shown in Figure 3.
Refer to the DC Characteristics Table, Section 5.2
(commercial temperature) and Section 6.2
(extended temperature), for complete current and
voltage specifications. Refer to the AC
Characteristics Table, Section 5.3 (commercial
temperature) and Section 6.3 (extended
temperature), for read, write and erase performance
specifications.
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4-MBIT SmartVoltage BOOT BLOCK FAMILY
7
PRELIMINARY
1.3
Applications
The 4-Mbit boot block flash memory family
combines high-density, low-power, high-
performance, cost-effective flash memories with
blocking and hardware protection capabilities. Their
flexibility and versatility reduce costs throughout the
product life cycle. Flash memory is ideal for Just-In-
Time production flow, reducing system inventory
and costs, and eliminating component handling
during the production phase.
When your product is in the end-user’s hands, and
updates or feature enhancements become
necessary, flash memory reduces the update costs
by allowing user-performed code changes instead
of costly product returns or technician calls.
The 4-Mbit boot block flash memory family provides
full-function, blocked flash memories suitable for a
wide range of applications. These applications
include extended PC BIOS and ROM-able
applications storage, digital cellular phone program
and data storage, telecommunication boot/firmware,
printer firmware/font storage and various other
embedded applications where program and data
storage are required.
Reprogrammable systems, such as personal
computers, are ideal applications for the 4-Mbit
flash memory products. Increasing software
sophistication greatens the probability that a code
update will be required after the PC is shipped. For
example, the emerging of “plug and play” standard
in desktop and portable PCs enables auto-
configuration of ISA and PCI add-in cards.
However, since the “plug and play” specification
continues to evolve, a flash BIOS provides a cost-
effective capability to update existing PCs. In
addition, the parameter blocks are ideal for storing
the required auto-configuration parameters,
allowing you to integrate the BIOS PROM and
parameter storage EEPROM into a single
component, reducing parts costs while increasing
functionality.
The 4-Mbit flash memory products are also
excellent design solutions for digital cellular phone
and telecommunication switching applications
requiring very low power consumption, high-
performance, high-density storage capability,
modular software designs, and a small form factor
package. The 4-Mbit’s blocking scheme allows for
easy segmentation of the embedded code with
16 Kbytes of hardware-protected boot code, four
main blocks of program code and two parameter
blocks of 8 Kbytes each for frequently updated data
storage and diagnostic messages (e.g., phone
numbers, authorization codes).
Intel’s boot block architecture provides a flexible
voltage solution for the different design needs of
various applications. The asymmetrically-blocked
memory map allows the integration of several
memory components into a single flash device. The
boot block provides a secure boot PROM; the
parameter blocks can emulate EEPROM
functionality for parameter store with proper
software techniques; and the main blocks provide
code and data storage with access times fast
enough to execute code in place, decreasing RAM
requirements.
1.4
Pinouts
Intel’s SmartVoltage Boot Block architecture
provides upgrade paths in every package pinout to
the 8-Mbit density. The 28F004B 40-lead TSOP
pinout for space-constrained designs is shown in
Figure 3. The 28F400 44-lead PSOP pinout follows
the industry-standard ROM/EPROM pinout, as
shown in Figure 4. For designs that require x16
operation but have space concerns, refer to the
48-lead pinout in Figure 5. Furthermore, the 28F400
56-lead TSOP pinout shown in Figure 6 provides
density upgrades to future higher density boot block
memories.
Pinouts for the corresponding 2-Mbit and 8-Mbit
components are also provided for convenient
reference. 4-Mbit pinouts are given on the chip
illustration in the center, with 2-Mbit and 8-Mbit
pinouts going outward from the center.
4-MBIT SmartVoltage BOOT BLOCK FAMILY
E
8
PRELIMINARY
A[18:1]
CS#
RD#
WR#
D[0:15]
A[0:17]
CE#
OE#
WE#
DQ[0:15]
28F400BV-60
RP#
i386™ EX CPU
(25 MHz)
RESET
RESET
0530_01
NOTE:
A data bus buffer may be needed for processor speeds above 25 MHz.
Figure 1. 28F400 Interface to Intel386™ EX Microprocessor
UCS#
80C188EB
-A
15
A
8
ALE
P1.X
WR#
RD#
RESIN#
System Reset
WE#
OE#
V
PP
ADDRESS
LATCHES
LE
ADDRESS
LATCHES
LE
CE#
A
0
-A
18
RP#
28F004-T
-AD
7
AD
0
A[16:18]
DQ
0
-DQ
7
WP#
V
CC
10K
Ω
P1.X
V
CC
0530_02
Figure 2. 28F004B Interface to Intel80C188EB 8-Bit Embedded Microprocessor
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4-MBIT SmartVoltage BOOT BLOCK FAMILY
9
PRELIMINARY
28F004B
Boot Block
40-Lead TSOP
10 mm x 20 mm
TOP VIEW
32
31
30
29
28
27
26
25
24
23
22
21
33
34
35
36
37
38
39
40
20
19
17
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
A
1
A
2
A
3
RP#
WE#
V
PP
A
16
A
15
A
7
A
6
A
5
A
4
A
14
A
13
A
8
A
9
A
11
A
12
WP#
DQ
7
CE#
OE#
GND
A
0
DQ
6
DQ
5
DQ
4
DQ
2
DQ
1
DQ
0
V
CC
DQ
3
A
17
GND
NC
A
10
NC
NC
NC
28F002B
28F002B
28F008B
28F008B
DQ
7
CE#
OE#
GND
A
0
DQ
6
DQ
5
DQ
4
DQ
2
DQ
1
DQ
0
V
CC
V
CC
DQ
3
A
17
GND
NC
A
10
NC
A
1
A
2
A
3
RP#
WE#
V
PP
A
16
A
15
A
7
A
6
A
5
A
4
A
14
A
13
A
8
A
9
A
11
A
12
WP#
A
1
A
2
A
3
RP#
WE#
V
PP
A
16
A
15
A
7
A
6
A
5
A
4
A
14
A
13
A
8
A
9
A
11
A
12
WP#
A
18
A
18
A
19
DQ
7
CE#
OE#
GND
A
0
DQ
6
DQ
5
DQ
4
DQ
2
DQ
1
DQ
0
V
CC
DQ
3
A
17
GND
NC
A
10
NC
NC
V
CC
V
CC
0530_03
Figure 3. The 40-Lead TSOP Offers the Smallest Form Factor for Space-Constrained Applications
PA28F400
Boot Block
44-Lead PSOP
0.525" x 1.110"
TOP VIEW
32
31
30
29
28
27
26
25
24
23
33
34
35
36
37
38
39
40
41
42
43
44
22
21
20
19
17
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
RP#
WE#
A
A
A
A
A
A
A
A
A
BYTE#
GND
DQ /A
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
8
9
10
11
12
13
14
15
16
15
7
14
6
13
5
12
4
CC
-1
28F800 28F200
V
PP
WP#
NC
A
7
A
6
A
5
A
4
A