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1
Motorola Sensor Device Data
700 kPa
Uncompensated
Silicon Pressure Sensors
The MPX700 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output — directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.
Features
Low Cost
Patented, Silicon Shear Stress Strain Gauge Design
Linearity to
±
0.5% (Max) Linearity
Easy to Use Chip Carrier Package Options
Ratiometric to Supply Voltage
60 mV Span (Typ)
Absolute, Differential and Gauge Options
Application Examples
Environmental Control Systems
Pneumatic Control Systems
Appliances
Automotive Performance Controls
Medical Instrumentation
Industrial Controls
Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure
sensor chip.
Figure 1. Uncompensated Pressure Sensor Schematic
PIN 3
X–ducer
PIN 2
PIN 4
+ Vout
– Vout
+ VS
PIN 1
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side. This sensor is designed for applications where P1 is
always greater than, or equal to P2.
Senseon and X–ducer are trademarks of Motorola, Inc.
Order this document
by MPX700/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
©
Motorola, Inc. 1997
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
MPX700
SERIES
0 to 700 kPa (0 – 100 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
NOTE: Pin 1 is the notched pin.
PIN NUMBER
1
2
Gnd
+Vout
3
4
VS
–Vout
REV 5
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MPX700 SERIES
2
Motorola Sensor Device Data
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Overpressure(8) (P2
v
1 Atmosphere)
P1max
2800
kPa
Burst Pressure(8) (P2
v
1 Atmosphere)
P1burst
5000
kPa
Storage Temperature
Tstg
– 40 to +125
°
C
Operating Temperature
TA
– 40 to +125
°
C
OPERATING CHARACTERISTICS
(VS = 3.0 Vdc, TA = 25
°
C unless otherwise noted. P1
w
P2; P2
v
1 Atmosphere.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
700
kPa
Supply Voltage(2)
VS
3.0
6.0
Vdc
Supply Current
Io
6.0
mAdc
Full Scale Span(3)
VFSS
45
60
90
mV
Offset(4)
Voff
0
20
35
mV
Sensitivity
V/
P
86
µ
V/kPa
Linearity(5)
MPX700D
MPX700A
– 0.5
– 1.0
0.5
1.0
%VFSS
Pressure Hysteresis(5) (0 to 700 kPa)
±
0.1
%VFSS
Temperature Hysteresis(5) (– 40
°
C to +125
°
C)
±
0.5
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
– 0.21
– 0.15
%VFSS/
°
C
Temperature Coefficient of Offset(5)
TCVoff
±
15
µ
V/
°
C
Temperature Coefficient of Resistance(5)
TCR
0.34
0.4
%Zin/
°
C
Input Impedance
Zin
400
550
Output Impedance
Zout
750
1800
Response Time(6) (10% to 90%)
tR
1.0
ms
Warm–Up (7)
20
ms
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Weight (Basic Element, Case 344–15)
2.0
Grams
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25
°
C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85
°
C, relative to 25
°
C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85
°
C, relative
to 25
°
C.
TCR:
Zin deviation with minimum rated pressure applied, over the temperature range of – 40
°
C to +125
°
C,
relative to 25
°
C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
8. Basic Element only, Case 344–15.
9. P2 max : 500 kPa.
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MPX700 SERIES
3
Motorola Sensor Device Data
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX700 series over temperature.
The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This de-
vice uses a unique transverse voltage diffused semiconduc-
tor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ-
ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components
or by designing your system using the MPX2700 series
sensors.
Several approaches to external temperature compensa-
tion over both – 40 to +125
°
C and 0 to + 80
°
C ranges are
presented in Motorola Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the cal-
culations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Figure 2. Output versus Pressure Differential
Figure 3. Linearity Specification Comparison
Figure 4. Cross–Sectional Diagrams (not to scale)
OFFSET
(VOFF)
70
OUTPUT
(mVdc)
50
40
30
20
10
0
0
MAX
POP
SPAN
(VFSS)
PRESSURE (kPA)
ACTUAL
THEORETICAL
LINEARITY
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
ABSOLUTE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
ABSOLUTE ELEMENT
P1
P2
P1
P2
80
70
60
50
40
30
20
10
0
0
60
PSI
700
560
420
280
140
kPa
OUTPUT
(mVdc)
PRESSURE DIFFERENTIAL
20
100
80
SPAN
RANGE
(TYP)
OFFSET
(TYP)
MPX700
VS = 3 Vdc
P1 > P2
– 40
°
C
+ 25
°
C
+ 125
°
C
40
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344–15). A silicone gel iso-
lates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the sil-
icon diaphragm.
The MPX700 series pressure sensor operating character-
istics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information re-
garding media compatibility in your application.
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MPX700 SERIES
4
Motorola Sensor Device Data
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The differential or
gauge sensor is designed to operate with positive differential
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table on the below:
Part Number
Case Type
Pressure (P1) Side Identifier
MPX700A, MPX700D
344–15
C
Stainless Steel Cap
MPX700DP
344C–01
Side with Part Marking
MPX700AP, MPX700GP
344B–01
Side with Port Attached
MPX700GVP
344D–01
Stainless Steel Cap
MPX700AS, MPX700GS
344E–01
Side with Port Attached
MPX700ASX, MPX700GSX
344F–01
Side with Port Attached
MPX700GVSX
344G–01
Stainless Steel Cap
ORDERING INFORMATION
MPX700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
D
i
T
O
i
C
T
MPX Series
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Absolute, Differential
Case 344–15
MPX700A
MPX700D
MPX700A
MPX700D
Ported Elements
Differential
Case 344C–01
MPX700DP
MPX700DP
Absolute, Gauge
Case 344B–01
MPX700AP
MPX700GP
MPX700AP
MPX700GP
Gauge Vacuum
Case 344D–01
MPX700GVP
MPX700GVP
Absolute, Gauge Stove Pipe
Case 344E–01
MPX700AS
MPX700GS
MPX700A
MPX700D
Absolute, Gauge Axial
Case 344F–01
MPX700ASX
MPX700GSX
MPX700A
MPX700D
Gauge Vacuum Axial
Case 344G–01
MPX700GVSX
MPX700D
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MPX700 SERIES
5
Motorola Sensor Device Data
PACKAGE DIMENSIONS
CASE 344–15
ISSUE W
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
M
A
M
0.136 (0.005)
T
1
2
3
4
PIN 1
R
N
L
G
F
D
4 PL
SEATING
PLANE
–T–
C
M
J
B
–A–
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.595
0.630
15.11
16.00
B
0.514
0.534
13.06
13.56
C
0.200
0.220
5.08
5.59
D
0.016
0.020
0.41
0.51
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.40
L
0.695
0.725
17.65
18.42
M
30 NOM
30 NOM
N
0.475
0.495
12.07
12.57
R
0.430
0.450
10.92
11.43
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
POSITIVE
PRESSURE (P1)
POSITIVE
PRESSURE
(P1)
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
CASE 344B–01
ISSUE B
SEATING
PLANE
B
N
R
C
J
–T–
D
F
U
H
L
PORT #1
POSITIVE
PRESSURE
PIN 1
–A–
–Q–
S
K
G
4 PL
–P–
S
Q
M
0.25 (0.010)
T
S
S
M
0.13 (0.005)
Q
S
T
1 2
3 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.145
1.175
29.08
29.85
B
0.685
0.715
17.40
18.16
C
0.305
0.325
7.75
8.26
D
0.016
0.020
0.41
0.51
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
H
0.182
0.194
4.62
4.93
J
0.014
0.016
0.36
0.41
K
0.695
0.725
17.65
18.42
L
0.290
0.300
7.37
7.62
N
0.420
0.440
10.67
11.18
P
0.153
0.159
3.89
4.04
Q
0.153
0.159
3.89
4.04
R
0.230
0.250
5.84
6.35
S
U
0.910 BSC
23.11 BSC
0.220
0.240
5.59
6.10
(P1)
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MPX700 SERIES
6
Motorola Sensor Device Data
PACKAGE DIMENSIONS — CONTINUED
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
PORT #2
PORT #1
PORT #2
VACUUM
SEATING
PLANE
SEATING
PLANE
K
S
W
H
L
U
F
G
D
PORT #1
POSITIVE PRESSURE
–Q–
1 2
4
3
PIN 1
4 PL
–P–
–T–
–T–
S
Q
M
0.25 (0.010)
T
S
S
M
0.13 (0.005)
Q
S
T
B
N
J
C
V
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.145
1.175
29.08
29.85
B
0.685
0.715
17.40
18.16
C
0.405
0.435
10.29
11.05
D
0.016
0.020
0.41
0.51
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
H
0.182
0.194
4.62
4.93
J
0.014
0.016
0.36
0.41
K
0.695
0.725
17.65
18.42
L
0.290
0.300
7.37
7.62
N
0.420
0.440
10.67
11.18
P
0.153
0.159
3.89
4.04
Q
0.153
0.159
3.89
4.04
R
0.063
0.083
1.60
2.11
S
U
0.910 BSC
23.11 BSC
V
0.248
0.278
6.30
7.06
W
0.310
0.330
7.87
8.38
–A–
0.220
0.240
5.59
6.10
(P2)
(P1)
CASE 344C–01
ISSUE B
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
B
N
R
C
J
–T–
D
F
U
L
H
PORT #2
VACUUM
POSITIVE
PRESSURE
PIN 1
–A–
–Q–
S
K
G
4 PL
–P–
S
Q
M
0.25 (0.010)
T
S
S
M
0.13 (0.005)
Q
S
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.145
1.175
29.08
29.85
B
0.685
0.715
17.40
18.16
C
0.305
0.325
7.75
8.26
D
0.016
0.020
0.41
0.51
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
H
0.182
0.194
4.62
4.93
J
0.014
0.016
0.36
0.41
K
0.695
0.725
17.65
18.42
L
0.290
0.300
7.37
7.62
N
0.420
0.440
10.67
11.18
P
0.153
0.159
3.89
4.04
Q
0.153
0.158
3.89
4.04
R
0.230
0.250
5.84
6.35
S
U
0.910 BSC
23.11 BSC
1 2
3 4
0.220
0.240
5.59
6.10
(P2)
(P1)
CASE 344D–01
ISSUE B
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MPX700 SERIES
7
Motorola Sensor Device Data
PACKAGE DIMENSIONS — CONTINUED
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.690
0.720
17.53
18.28
B
0.245
0.255
6.22
6.48
C
0.780
0.820
19.81
20.82
D
0.016
0.020
0.41
0.51
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.41
K
0.345
0.375
8.76
9.53
N
0.300
0.310
7.62
7.87
R
0.178
0.186
4.52
4.72
S
V
0.182
0.194
4.62
4.93
BACK SIDE
VACUUM
PIN 1
4 PL
PORT #1
POSITIVE
PRESSURE
4
SEATING
PLANE
3
2 1
K
A
G
F