MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
2–9
REV 5
©
Motorola, Inc. 1996
3/93
Dual Binary to 1-4 Decoder
(Low)
The MC10H171 is a binary coded 2 line to dual 4 line decoder with selected
outputs low. With either E0 or E1 high, the corresponding selected 4 outputs are
high. The common enable E, when high, forces all outputs high.
•
Propagation Delay, 2 ns Typical
•
Power Dissipation 325 mW Typical (same as MECL 10K)
•
Improved Noise Margin 150 mV (over operating voltage and
temperature range)
•
Voltage Compensated
•
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
Power Supply (VCC = 0)
VEE
–8 to 0
Vdc
Input Voltage (VCC = 0)
VI
0 to VEE
Vdc
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
0 to +75
°
C
Storage Temperature Range — Plastic
— Ceramic
Tstg
–55 to +150
–55 to +165
°
C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V
±
5%) (See Note)
0
°
25
°
75
°
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
IE
—
85
—
77
—
85
mA
Input Current High
IinH
—
425
—
265
—
265
µ
A
Input Current Low
IinL
0.5
—
0.5
—
0.3
—
µ
A
High Output Voltage
VOH
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
VOL
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
High Input Voltage
VIH
–1.17
–0.84
–1.13
–0.81
–1.07
–0.735
Vdc
Low Input Voltage
VIL
–1.95
–1.48
–1.95
–1.48
–1.95
–1.45
Vdc
AC PARAMETERS
0
°
25
°
75
°
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Propagation Delay
Data
Select
tpd
0.5
0.5
2.0
2.6
0.5
0.5
2.1
2.7
0.5
0.5
2.2
2.8
ns
Rise Time
tr
0.5
1.7
0.5
1.8
0.5
1.9
ns
Fall Time
tf
0.5
1.7
0.5
1.8
0.5
1.9
ns
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
MC10H171
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
VCC1
E1
Q13
Q12
Q11
Q10
B
VEE
VCC2
E
E0
Q00
Q01
Q02
Q03
A
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
E0 14
A 9
B 7
E 15
E1 2
10 Q0 3
11 Q0 2
12 Q0 1
13 Q0 0
3 Q1 3
4 Q1 2
5 Q1 1
6 Q1 0
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
MC10H171
2–11
MOTOROLA
MECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
S
0.010 (0.250)
N
S
T
X
G1
B
U
Z
VIEW D–D
20
1
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
S
0.010 (0.250)
N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
H
VIEW S
K
K1
F
G1
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.385
0.395
9.78
10.03
B
0.385
0.395
9.78
10.03
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
–––
0.51
–––
K
0.025
–––
0.64
–––
R
0.350
0.356
8.89
9.04
U
0.350
0.356
8.89
9.04
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
–––
0.020
–––
0.50
Z
2
10
2
10
G1
0.310
0.330
7.88
8.38
K1
0.040
–––
1.02
–––
_
_
_
_
MC10H171
MOTOROLA
MECL Data
DL122 — Rev 6
2–12
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1
8
9
16
K
PLANE
–T–
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
_
_
_
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010)
T
16 PL
J
S
B
M
0.25 (0.010)
T
M
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.750
0.785
19.05
19.93
B
0.240
0.295
6.10
7.49
C
–––
0.200
–––
5.08
D
0.015
0.020
0.39
0.50
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
0.100 BSC
2.54 BSC
H
0.008
0.015
0.21
0.38
K
0.125
0.170
3.18
4.31
L
0.300 BSC
7.62 BSC
M
0
15
0
15
N
0.020
0.040
0.51
1.01
_
_
_
_
16
9
1
8
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
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MC10H171/D
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