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MOTOROLA

MMQA Series

SC 59 Quad Monolithic

Common Anode

Transient Voltage Suppressor

for ESD Protection

This quad monolithic silicon voltage suppressor is designed for applications

requiring transient overvoltage protection capability. It is intended for use in

voltage and ESD sensitive equipment such as computers, printers, business

machines, communication systems, medical equipment, and other applica-

tions. Its quad junction common anode design protects four separate lines

using only one package. These devices are ideal for situations where board

space is at a premium.

Specification Features:

•

SC-59 Package Allows Four Separate Unidirectional Configurations

•

Peak Power — Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform

•

Peak Power — Min. 150 W @ 20

s (Unidirectional), per Figure 6 Waveform

•

Maximum Clamping Voltage @ Peak Pulse Current

•

Low Leakage < 2.0

•

ESD Rating of Class N (exceeding 16 kV) per the Human Body Model

Mechanical Characteristics:

•

Void Free, Transfer-Molded, Thermosetting Plastic Case

•

Corrosion Resistant Finish, Easily Solderable

•

Package Designed for Optimal Automated Board Assembly

•

Small Package Size for High Density Applications

•

Available in 8 mm Tape and Reel

Use the Device Number to order the 7 inch/3,000 unit reel. Replace

with “T3” in the Device Number to order the 13 inch/10,000 unit reel.

THERMAL CHARACTERISTICS

(TA = 25

C unless otherwise noted)

Characteristic

Symbol

Value

Unit

Peak Power Dissipation @ 1.0 ms (1) @ TA

≤

Ppk

Watts

Peak Power Dissipation @ 20

s (2) @ TA

≤

Ppk

150

Watts

Total Power Dissipation on FR-5 Board (3) @ TA = 25

225

1.8

mW/

Thermal Resistance from Junction to Ambient

556

C/W

Total Power Dissipation on Alumina Substrate (4) @ TA = 25

Derate above 25

300

2.4

mW/

Thermal Resistance from Junction to Ambient

417

C/W

Junction and Storage Temperature Range

TJ, Tstg

– 55 to +150

Lead Solder Temperature — Maximum (10 Second Duration)

260

1. Non-repetitive current pulse per Figure 5 and derate above TA = 25

C per Figure 4.

2. Non-repetitive current pulse per Figure 6 and derate above TA = 25

C per Figure 4.

3. FR-5 = 1.0 x 0.75 x 0.62 in.

4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina

Preferred devices are Motorola recommended choices for future use and best overall value.

Thermal Clad is a trademark of the Bergquist Company

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document

by MMQA/D

Motorola, Inc. 1996

MMQA Series

SC-59 QUAD

TRANSIENT VOLTAGE

SUPPRESSOR

24 WATTS PEAK POWER

5.6 – 33 VOLTS

CASE 318F-01

STYLE 1

SC-59 PLASTIC

Motorola Preferred Devices

PIN 1. CATHODE

2. ANODE

3. CATHODE

4. CATHODE

5. ANODE

6. CATHODE

MOTOROLA

MMQA Series

ELECTRICAL CHARACTERISTICS

(TA = 25

C unless otherwise noted)

UNIDIRECTIONAL

(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA)

Breakdown Voltage

Max Reverse

Leakage Current

Max Zener

Impedance (7)

Max Reverse

Surge

Max Reverse

Voltage @

IRSM(6)

Maximum

Temperature

VZT (5)

(V)

@ IZT

Impedance (7)

Surge

Current

IRSM(6)

(Clamping

Voltage)

Coefficient of

Device

Min

Nom

Max

(mA)

(nA)

(V)

ZZT @ IZT

(

Ω

)

(mA)

IRSM(4)

(A)

VRSM

(V)

(mV/

MMQA5V6T1,T3

5.32

5.6

5.88

1.0

2000

3.0

400

3.0

8.0

1.26

MMQA6V2T1,T3

5.89

6.2

6.51

1.0

700

4.0

300

2.66

9.0

10.6

MMQA6V8T1,T3

6.46

6.8

7.14

1.0

500

4.3

300

2.45

9.8

10.9

MMQA12VT1,T3

11.4

12.6

1.0

9.1

1.39

17.3

MMQA13VT1,T3

12.4

13.7

1.0

9.8

1.29

18.6

MMQA15VT1,T3

14.3

15.8

1.0

1.1

21.7

MMQA18VT1,T3

17.1

18.9

1.0

0.923

MMQA20VT1,T3

1.0

0.84

28.6

20.1

MMQA21VT1,T3

22.1

1.0

0.792

30.3

MMQA22VT1,T3

20.9

23.1

1.0

0.758

31.7

MMQA24VT1,T3

22.8

25.2

1.0

100

0.694

34.6

MMQA27VT1,T3

25.7

28.4

1.0

125

0.615

MMQA30VT1,T3

28.5

31.5

1.0

150

0.554

43.3

MMQA33VT1,T3

31.4

34.7

1.0

200

0.504

48.6

(5) VZ measured at pulse test current IT at an ambient temperature of 25

(6) Surge current waveform per Figure 5 and derate per Figure 4.

(7) ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz.

NOTE: SPECS LISTED ABOVE ARE PRELIMINARY

TYPICAL CHARACTERISTICS

300

VZ, NOMINAL ZENER VOLTAGE (V)

C, CAP

ACIT

ANCE

(pF)

250

200

150

100

5.6

6.8

BIASED AT 0 V

BIASED AT 1 V

BIASED AT 50%

OF VZ NOM

Figure 1. Typical Capacitance

5.6

6.8

10,000

1,000

100

Figure 2. Typical Leakage Current

I R

, LEAKAGE (nA)

VZ, NOMINAL ZENER VOLTAGE (V)

+150

+25

–40

MOTOROLA

MMQA Series

TYPICAL CHARACTERISTICS

Figure 3. Steady State Power Derating Curve

Figure 4. Pulse Derating Curve

Figure 5. 10

1000

s Pulse Waveform

100

125

150

175

300

250

200

150

100

, POWER DISSIP

TION

(mW)

TA, AMBIENT TEMPERATURE (

FR-5 BOARD

ALUMINA SUBSTRATE

100

125

150

175

200

TA, AMBIENT TEMPERATURE (

PEAK

PULSE

DERA

TING IN % OF PEAK POWER

OR CURRENT

= 25

ALUE (%)

100

t, TIME (ms)

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAYS TO 50%

OF IRSM.

≤

HALF VALUE —

IRSM

PEAK VALUE — IRSM

Figure 6. 8

s Pulse Waveform

Figure 7. Maximum Non–Repetitive Surge

Power, Ppk versus PW

Figure 8. Typical Maximum Non–Repetitive

Surge Power, Ppk versus VBR

Ppk PEAK SURGE POWER (W)

0.1

1.0

100

1000

1.0

100

Power is defined as VRSM x IZ(pk) where VRSM

is the clamping voltage at IZ(pk).

PW, PULSE WIDTH (ms)

UNIDIRECTIONAL

RECTANGULAR

WAVEFORM, TA = 25

100

t, TIME (

% OF PEAK PULSE CURRENT

200

180

160

140

120

100

5.6

6.8

NOMINAL VZ

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAY = 8

PEAK VALUE IRSM @ 8

HALF VALUE IRSM/2 @ 20

, PEAK SURGE POWER (W)

20 WAVEFORM AS PER FIGURE 6

100 WAVEFORM AS PER FIGURE 5

MOTOROLA

MMQA Series

INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self-align when subjected to

a solder reflow process.

inches

SC-59 6 LEAD

0.028

0.7

0.074

1.9

0.037

0.95

0.037

0.95

0.094

2.4

0.039

1.0

SC-59 6 LEAD POWER DISSIPATION

The power dissipation of the SC-59 6 Lead is a function of

the pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power dissipation.

Power dissipation for a surface mount device is determined

by TJ(max), the maximum rated junction temperature of the

die, R

JA, the thermal resistance from the device junction to

ambient, and the operating temperature, TA. Using the

values provided on the data sheet for the SC-59 6 Lead

package, PD can be calculated as follows:

PD =

TJ(max) – TA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25

C, one can

calculate the power dissipation of the device which in this

case is 225 milliwatts.

PD =

150

C – 25

556

C/W

= 225 milliwatts

The 556

C/W for the SC-59 6 Lead package assumes the

use of the recommended footprint on a glass epoxy printed

circuit board to achieve a power dissipation of 225 milliwatts.

There are other alternatives to achieving higher power

dissipation from the SC-59 6 Lead package. Another alterna-

tive would be to use a ceramic substrate or an aluminum

core board such as Thermal Clad

™

. Using a board material

such as Thermal Clad, an aluminum core board, the power

dissipation can be doubled using the same footprint.

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads.

Solder stencils are used to screen the optimum amount.

These stencils are typically 0.008 inches thick and may be

made of brass or stainless steel. For packages such as the

SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23,

SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC

diode packages, the stencil opening should be the same as

the pad size or a 1:1 registration.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to mini-

mize the thermal stress to which the devices are subjected.

•

Always preheat the device.

•

The delta temperature between the preheat and

soldering should be 100

C or less.*

•

When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

MOTOROLA

MMQA Series

•

The soldering temperature and time should not exceed

260

C for more than 10 seconds.

•

When shifting from preheating to soldering, the

maximum temperature gradient should be 5

C or less.

•

After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used since the use of forced

cooling will increase the temperature gradient and will

result in latent failure due to mechanical stress.

•

Mechanical stress or shock should not be applied during

cooling.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones and a figure

for belt speed. Taken together, these control settings make

up a heating “profile” for that particular circuit board. On

machines controlled by a computer, the computer remem-

bers these profiles from one operating session to the next.

Figure 9 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems, but it is a

good starting point. Factors that can affect the profile include

the type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177 –189

C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

“RAMP”

STEP 2

VENT

“SOAK”

STEP 3

HEATING

ZONES 2 & 5

“RAMP”

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

STEP 6

VENT

STEP 7

COOLING

200

150

100

TIME (3 TO 7 MINUTES TOTAL)

TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205

TO 219

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100

150

160

170

140

Figure 9. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

MOTOROLA

MMQA Series

OUTLINE DIMENSIONS

CASE 318F-01

ISSUE A

SC-59 6 LEAD

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

STYLE 1:

PIN 1. CATHODE

2. ANODE

3. CATHODE

4. CATHODE

5. ANODE

6. CATHODE

MIN

MAX

INCHES

MILLIMETERS

DIM

2.70

1.30

1.00

0.35

0.85

0.013

0.10

0.20

1.25

2.50

3.10

1.70

1.30

0.50

1.05

0.100

0.26

0.60

1.65

3.00

0.1063

0.0512

0.0394

0.0138

0.0335

0.0005

0.0040

0.0079

0.0493

0.0985

0.1220

0.0669

0.0511

0.0196

0.0413

0.0040

0.0102

0.0236

0.0649

0.1181

0.05 (0.002)

MOTOROLA

MMQA Series

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal

Opportunity/Affirmative Action Employer.

How to reach us:

USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;

JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

P.O. Box 5405; Denver, Colorado 80217. 1–800–441–2447

3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315

MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609

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INTERNET: http://Design–NET.com

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

MMQA/D

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