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DATA SHEET
Product specification
File under Integrated Circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA1516BQ
24 W BTL or 2 x 12 watt stereo car
radio power amplifier
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July 1994
2
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
GENERAL DESCRIPTION
The TDA 1516BQ is an integrated class-B output amplifier in a 13-lead single-in-line (SlL) plastic power package.
The device is primarily developed for car radio applications.
FEATURES
Requires very few external components
Flexibility in use
stereo as well as mono BTL
High output power (without bootstrap)
Low offset voltage at output (important for BTL)
Fixed gain
Good ripple rejection
Mute/stand-by switch
Load dump protection
A.C. and d.c. short-circuit-safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
P
= 0 V)
No switch-on/switch-off plop
Flexible leads
Low thermal resistance
Identical inputs (inverting and non-inverting)
Compatible with TDA1518Q (except gain)
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
operating
V
P
6,0
14,4
18,0
V
non-operating
V
P
30,0
V
load dump protected
V
P
45,0
V
Repetitive peak output
current
I
ORM
4
A
Total quiescent current
I
tot
30
mA
Stand-by current
I
sb
0,1
100
µ
A
Switch-on current
I
sw
40
µ
A
Input impedance
BTL
|Z
I
|
25
k
stereo
|Z
I
|
50
k
Stereo application
Output power
THD = 10%; 4
P
o
6
W
THD = 10%; 2
P
o
11
W
Channel separation
α
40
dB
Noise output voltage
V
no(rms)
50
µ
V
BTL application
Output power
THD = 10%; 4
P
o
22
W
Supply voltage
R
S
= 0
;
ripple rejection
f = 100 Hz to 10 kHz
RR
48
dB
D.C. output offset voltage
|
V
O
|
100
mV
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July 1994
3
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141); SOT141-6; 1996 July 24.
Fig.1 Block diagram.
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July 1994
4
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PINNING
FUNCTIONAL DESCRIPTION
The TDA1516BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or
bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by
switch which has the following features:
low stand-by current (< 100
µ
A)
low mute/stand-by switching current (low cost supply switch)
mute condition.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1
INV1
non-inverting input 1
8
BS2
bootstrap 2
2
INV
inverting input
9
OUT2
output 2
3
GND1
ground (signal)
10
V
P
supply voltage
4
V
ref
reference voltage
11
M/SS
mute/stand-by switch
5
OUT1
output 1
12
RR
supply voltage ripple rejection
6
BS1
bootstrap 1
13
INV2
non-inverting input 2
7
GND2
ground (substrate)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
operating
V
P
18
V
non-operating
V
P
30
V
load dump protected
during 50 ms;
t
r
2,5 ms
V
P
45
V
A.C. and d.c. short-circuit-
safe voltage
V
PSC
18
V
Reverse polarity
V
PR
6
V
Energy handling capability
at outputs
V
P
= 0 V
200
mJ
Non-repetitive peak output
current
I
OSM
6
A
Repetitive peak output
current
I
ORM
4
A
Total power dissipation
see Fig.2
P
tot
25
W
Crystal temperature
T
c
150
°
C
Storage temperature range
T
stg
55
+ 150
°
C
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July 1994
5
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
Fig.2 Power derating curve.
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July 1994
6
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
D.C. CHARACTERISTICS (note 1)
V
P
= 14,4 V; T
amb
= 25
°
C; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
note 2
V
P
6,0
14,4
18,0
V
Quiescent current
I
P
40
80
mA
D.C. output voltage at
approximately V
P
/2
note 3
V
O
6,8
V
D.C. output offset
voltage
|
V
5-9
|
100
mV
Mute/stand-by switch
Switch-on voltage level
V
ON
8,5
V
Mute condition
V
mute
3,0
6,4
V
Output signal in mute
V
I
= 1 V (max.);
position
f = 20 Hz to
15 kHz
V
O
2
mV
D.C. output offset
voltage
|
V
5-9
|
100
mV
Stand-by condition
V
sb
0
2
V
D.C. current in
stand-by condition
I
sb
100
µ
A
Switch-on current
I
sw
12
40
µ
A
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July 1994
7
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
A.C. CHARACTERISTICS
V
P
= 14,4 V; R
L
= 4
; f = 1 kHz; T
amb
= 25
°
C; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Stereo application
note 1
Output power
note 4;
THD = 0,5%
P
o
4
5
W
THD = 10%
P
o
5,5
6,0
W
notes 4 and 5;
THD = 10%
P
o
6
7
W
Output power at
note 4;
R
L
= 2
THD = 0,5%
P
o
7.5
8,5
W
THD = 10%
P
o
10
11
W
notes 4 and 5;
THD = 10%
P
o
10,5
12,0
W
Low frequency roll-off
note 6;
3 dB
f
L
45
Hz
High frequency roll-off
1 dB
f
H
20
kHz
Closed loop voltage gain
G
v
19
20
21
dB
Supply voltage ripple
rejection:
note 7
ON
RR
48
dB
mute
RR
48
dB
stand-by
RR
80
dB
Input impedance
|Z
I
|
50
60
75
k
Noise output voltage:
note 8;
ON
R
S
= 0
V
no(rms)
50
µ
V
ON
R
S
= 10 k
V
no(rms)
70
100
µ
V
mute
note 9
V
no(rms)
50
µ
V
Channel separation
R
S
= 10 k
α
40
dB
Channel balance
G
v
1
dB
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July 1994
8
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
Notes to the characteristics
1. All characteristics, for stereo application are measured using the circuit shown in Fig.3.
2. The circuit is d.c. adjusted at V
P
= 6 V to 18 V and a.c. operating at V
P
= 8,5 to 18 V.
3. At 18 V < V
P
< 30 V the d.c. output voltage
V
P
/2.
4. Output power is measured directly at the output pins of the IC.
5. With bootstrap and a 100 k
resistor from pin 12 to the positive supply voltage (V
P
), value of bootstrap capacitor is
47
µ
F.
6. Frequency response externally fixed.
7. Ripple rejection measured at the output with a source impedance of 0
(maximum ripple amplitude of 2 V) and a
frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of R
S
(V
I
= 0 V).
10. All characteristics, for BTL application are measured using the circuit shown in Fig.4.
BTL application
note 10
Output power
THD = 0,5%
P
o
15,5
17,0
W
THD = 10%
P
o
20
22
W
note 5; THD = 10%
P
o
21
24
W
Output power at V
P
= 13,2 V
THD = 0,5%
P
o
13,5
W
THD = 10%
P
o
17
W
note 5; THD = 10%
P
o
19
W
Power bandwidth
THD = 0,5%
P
o
= 15 W
B
w
20 to
Hz
15 000
Low frequency roll-off
note 6;
3 dB
f
L
25
Hz
High frequency roll-off
1 dB
f
H
20
kHz
Closed loop voltage gain
G
v
25
26
27
dB
Supply voltage ripple
rejection:
note 7
ON
RR
48
dB
mute
RR
48
dB
stand-by
RR
80
dB
Input impedance
|Z
I
|
25
30
38
k
Noise output voltage
note 8;
ON
R
S
= 0
V
no(rms)
70
µ
V
ON
R
S
= 10 k
V
no(rms)
100
200
µ
V
mute
note 9
V
no(rms)
60
µ
V
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
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July 1994
9
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
APPLICATION INFORMATION
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram (without bootstrapping).
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July 1994
10
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PACKAGE OUTLINE
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
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July 1994
11
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.