background image
Philips
Semiconductors
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP ROM, low pin count
Product specification
Supersedes data of 1998 Jan 19
IC20 Data Handbook
1998 May 01
INTEGRATED CIRCUITS
background image
Philips Semiconductors
Product specification
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP/ROM, low pin count
2
1998 May 01
853–1683 19331
DESCRIPTION
The Philips 8XC750 offers the advantages of the 80C51 architecture
in a small package and at low cost.
The 8XC750 Microcontroller is fabricated with Philips high-density
CMOS technology. Philips epitaxial substrate minimizes CMOS
latch-up sensitivity.
The 87C750 contains a 1k
×
8 EPROM, a 64
×
8 RAM, 19 I/O lines,
a 16-bit auto-reload counter/timer, a five-source, fixed-priority level
interrupt structure and an on-chip oscillator.
FEATURES
80C51 based architecture
Oscillator frequency range—up to 16MHz
Small package sizes
24-pin DIP (300 mil “skinny DIP”)
24-pin Shrink Small Outline Package
28-pin PLCC
87C750 available in one-time programmable plastic packages
Low power consumption:
Normal operation: less than 11mA @ 5V, 12MHz
Idle mode
Power-down mode
1k
×
8 EPROM (87C750)
64
×
8 RAM
16-bit auto reloadable counter/timer
Boolean processor
CMOS and TTL compatible
Well suited for logic replacement, consumer and industrial
applications
LED drive outputs
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
P3.4/A4
P3.3/A3
P3.2/A2/A10
P3.1/A1/A9
P3.0/A0/A8
P0.2/VPP
RST
X2
X1
V
SS
P0.0/ASEL
P1.0/D0
P1.1/D1
P1.2/D2
P1.3/D3
P1.4/D4
P1.5/INT0/D5
P1.6/INT1/D6
P1.7/T0/D7
P3.7/A7
P3.6/A6
P3.5/A5
V
CC
PLASTIC
DUAL
IN-LINE
AND
SHRINK
SMALL
OUTLINE
PACKAGE
PLASTIC
LEADED
CHIP
CARRIER
4
1
26
5
11
25
19
12
18
P0.1/OE–PGM
Pin
Function
1
P3.4/A4
2
P3.3/A3
3
P3.2/A2/A10
4
P3.1/A1/A9
5
NC*
6
P3.0/A0/A8
7
P0.2/V
PP
8
P0.1/OE-PGM
9
P0.0/ASEL
10
NC*
11
RST
12
X2
13
X1
14
V
SS
Pin
Function
15
P1.0/D0
16
P1.1/D1
17
P1.2/D2
18
P1.3/D3
19
P1.4/D4
20
P1.5/INT0/D5
21
NC*
22
NC*
23
P1.6/INT1/D6
24
P1.7/T0/D7
25
P3.7/A7
26
P3.6/A6
27
P3.5/A5
28
V
CC
SU00295A
* NO INTERNAL CONNECTION
ORDERING INFORMATION
ROM
EPROM
1
TEMPERATURE RANGE
°
C AND PACKAGE
FREQUENCY
DRAWING
NUMBER
P83C750EBP N
P87C750EBP N
OTP
0 to +70, Plastic Dual In-line Package
3.5 to 16MHz
SOT222-1
P83C750EFP N
P87C750EFP N
OTP
–40 to +85, Plastic Dual In-line Package
3.5 to 16MHz
SOT222-1
P83C750EBA A
P87C750EBA A
OTP
0 to +70, Plastic Lead Chip Carrier
3.5 to 16MHz
SOT261-3
P83C750EFA A
P87C750EFA A
OTP
–40 to +85, Plastic Lead Chip Carrier
3.5 to 16MHz
SOT261-3
P83C750EBD DB
P87C750EBD DB
OTP
0 to +70, Shrink Small Outline Package
3.5 to 16MHz
SOT340-1
NOTE:
1. OTP = One Time Programmable EPROM.
background image
Philips Semiconductors
Product specification
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP/ROM, low pin count
1998 May 01
3
BLOCK DIAGRAM
RST
X1
X2
VCC
VSS
RAM
EPROM
ACC
TMP2
TMP1
ALU
INSTRUCTION
REGISTER
PD
OSCILLATOR
PSW
BUFFER
DPTR
PCON
TCON
IE
TH0
TL0
RTH
RTL
INTERRUPT AND
TIMER BLOCKS
P1.0–P1.7
P3.0–P3.7
P0.0–P0.2
PORT 0
DRIVERS
RAM ADDR
REGISTER
PORT 0
LATCH
STACK
POINTER
PROGRAM
ADDRESS
REGISTER
PC
INCRE-
MENTER
PROGRAM
COUNTER
PORT 3
DRIVERS
PORT 1
DRIVERS
PORT 3
LATCH
PORT 1
LATCH
TIMING
AND
CONTROL
B
REGISTER
SU00312
background image
Philips Semiconductors
Product specification
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP/ROM, low pin count
1998 May 01
4
PIN DESCRIPTIONS
PIN NO.
MNEMONIC
DIP/
SSOP
LCC
TYPE
NAME AND FUNCTION
V
SS
12
14
I
Circuit Ground Potential
V
CC
24
28
I
Supply voltage during normal, idle, and power-down operation.
P0.0-P0.2
8-6
9-7
I/O
Port 0: Port 0 is a 3-bit open-drain, bidirectional port. Port 0 pins that have 1s written to them float,
and in that state can be used as high-impedance inputs. These pins are driven low if the port register
bit is written with a 0. The state of the pin can always be read from the port register by the program.
P0.0, P0.1, and P0.2 are open drain bidirectional I/O pins with the electrical characteristics listed in
the tables that follow. While these differ from “standard TTL” characteristics, they are close enough
for the pins to still be used as general-purpose I/O. Port 0 also provides alternate functions for
programming the EPROM memory as follows:
6
7
N/A
V
PP
(P0.2) – Programming voltage input. (See Note 1.)
7
8
I
OE/PGM (P0.1) – Input which specifies verify mode (output enable) or the program mode.
OE/PGM = 1 output enabled (verify mode).
OE/PGM = 0 program mode.
8
9
I
ASEL (P0.0) – Input which indicates which bits of the EPROM address are applied to port 3.
ASEL = 0 low address byte available on port 3.
ASEL = 1 high address byte available on port 3 (only the three least significant bits are used).
P1.0-P1.7
13-20
15-20,
23, 24
I/O
Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. Port 1 pins that have 1s written
to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 1 pins
that are externally pulled low will source current because of the internal pull-ups. (See DC
Electrical Characteristics: I
IL
). Port 1 serves to output the addressed EPROM contents in the verify
mode and accepts as inputs the value to program into the selected address during the program
mode. Port 1 also serves the special function features of the 80C51 family as listed below:
18
20
I
INT0 (P1.5): External interrupt.
19
23
I
INT1 (P1.6): External interrupt.
20
24
I
T0 (P1.7): Timer 0 external input.
P3.0-P3.7
5-1,
23-21
6, 4-1,
27-25
I/O
Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. Port 3 pins that have 1s written
to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 3 pins
that are externally being pulled low will source current because of the pull-ups. (See DC Electrical
Characteristics: I
IL
). Port 3 also functions as the address input for the EPROM memory location to
be programmed (or verified). The 10-bit address is multiplexed into this port as specified by
P0.0/ASEL.
RST
9
11
I
Reset: A high on this pin for two machine cycles while the oscillator is running, resets the device.
An internal diffused resistor to V
SS
permits a power-on RESET using only an external capacitor to
V
CC
. After the device is reset, a 10-bit serial sequence, sent LSB first, applied to RESET, places
the device in the programming state allowing programming address, data and V
PP
to be applied for
programming or verification purposes. The RESET serial sequence must be synchronized with the
X1 input.
X1
11
13
I
Crystal 1: Input to the inverting oscillator amplifier and input to the internal clock generator circuits.
X1 also serves as the clock to strobe in a serial bit stream into RESET to place the device in the
programming state.
X2
10
12
O
Crystal 2: Output from the inverting oscillator amplifier.
NOTE:
1. When P0.2 is at or close to 0 Volt, it may affect the internal ROM operation. We recommend that P0.2 be tied to V
CC
via a small pull-up (e.g.,
2k
).
OSCILLATOR CHARACTERISTICS
X1 and X2 are the input and output, respectively, of an inverting
amplifier which can be configured for use as an on-chip oscillator.
To drive the device from an external clock source, X1 should be
driven while X2 is left unconnected. There are no requirements on
the duty cycle of the external clock signal, because the input to the
internal clock circuitry is through a divide-by-two flip-flop. However,
minimum and maximum high and low times specified in the data
sheet must be observed.
RESET
A reset is accomplished by holding the RST pin high for at least two
machine cycles (24 oscillator periods), while the oscillator is running.
To insure a good power-up reset, the RST pin must be high long
enough to allow the oscillator time to start up (normally a few
milliseconds) plus two machine cycles. At power-up, the voltage on
V
CC
and RST must come up at the same time for a proper start-up.
IDLE MODE
In idle mode, the CPU puts itself to sleep while all of the on-chip
peripherals stay active. The instruction to invoke the idle mode is the
last instruction executed in the normal operating mode before the
idle mode is activated. The CPU contents, the on-chip RAM, and all
of the special function registers remain intact during this mode. The
idle mode can be terminated either by any enabled interrupt (at
which time the process is picked up at the interrupt service routine
and continued), or by a hardware reset which starts the processor in
the same manner as a power-on reset.
background image
Philips Semiconductors
Product specification
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP/ROM, low pin count
1998 May 01
5
POWER-DOWN MODE
In the power-down mode, the oscillator is stopped and the
instruction to invoke power-down is the last instruction executed.
Only the contents of the on-chip RAM are preserved. A hardware
reset is the only way to terminate the power-down mode. the control
bits for the reduced power modes are in the special function register
PCON.
Table 1.
External Pin Status During Idle and
Power-Down Modes
MODE
Port 0
Port 1
Port 2
Idle
Data
Data
Data
Power-down
Data
Data
Data
DIFFERENCES BETWEEN THE 8XC750 AND THE
80C51
Program Memory
On the 8XC750, program memory is 1024 bytes long and is not
externally expandable, so the 80C51 instructions MOVX, LJMP, and
LCALL are not implemented. The only fixed locations in program
memory are the addresses at which execution is taken up in
response to reset and interrupts, which are as follows:
Program Memory
Event
Address
Reset
000
External INT0
003
Counter/timer 0
00B
External INT1
013
Counter/Timer Subsystem
Timer/Counter
The 8XC750 has one timers: a 16-bit timer/counter. The 16-bit
timer/counter’s operation is similar to mode 2 operation on the
80C51, but is extended to 16 bits. The timer/counter is clocked by
either 1/12 the oscillator frequency or by transitions on the T0 pin.
The C/T pin in special function register TCON selects between
these two modes. When the TCON TR bit is set, the timer/counter is
enabled. Register pair TH and TL are incremented by the clock
source. When the register pair overflows, the register pair is
reloaded with the values in registers RTH and RTL. The value in the
reload registers is left unchanged. See the 83C750 counter/timer
block diagram in Figure 1. The TF bit in special function register
TCON is set on counter overflow and, if the interrupt is enabled, will
generate an interrupt.
TCON Register
MSB
LSB
GATE
C/T
TF
TR
IE0
IT0
IE1
IT1
GATE
1 – Timer/counter is enabled only when INT0 pin is high,
and TR is 1.
0 – Timer/counter is enabled when TR is 1.
C/T
1 – Counter/timer operation from T0 pin.
0 – Timer operation from internal clock.
TF
1 – Set on overflow of TH.
0 – Cleared when processor vectors to interrupt routine
and by reset.
TR
1 – Timer/counter enabled.
0 – Timer/counter disabled.
IE0
1 – Edge detected in INT0.
IT0
1 – INT0 is edge triggered.
0 – INT0 is level sensitive.
IE1
1 – Edge detected on INT1.
IT1
1 – INT1 is edge triggered.
0 – INT1 is level sensitive.
These flags are functionally identical to the corresponding 80C51
flags, except that there is only one timer on the 83C750 and the
flags are therefore combined into one register.
Note that the positions of the IE0/IT0 and IE1/IT1 bits are
transposed from the positions used in the standard 80C51 TCON
register.
Interrupt Subsystem – Fixed Priority
The IP register and the 2-level interrupt system of the 80C51 are
eliminated. Simultaneous interrupt conditions are resolved by a
single-level, fixed priority as follows:
Highest priority:
Pin INT0
Counter/timer flag 0
Pin INT1
Special Function Register Addresses
Special function registers for the 8XC750 are identical to those of
the 80C51, except for the changes listed below:
80C51 special function registers not present in the 8XC750 are
TMOD (89), P2 (A0) and IP (B8). The 80C51 registers TH1 and TL1
are replaced with the 87C750 registers RTH and RTL respectively
(refer to Table 2).
OSC
÷
12
TL
TH
TF
RTL
RTH
T0 Pin
TR
Gate
INT0 Pin
Int.
C/T = 0
C/T = 1
Reload
SU00300
Figure 1.
83C751 Counter/Timer Block Diagram
background image
Philips Semiconductors
Product specification
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP/ROM, low pin count
1998 May 01
6
Table 2.
87C750 Special Function Registers
SYMBOL
DESCRIPTION
DIRECT
ADDRESS
BIT ADDRESS, SYMBOL, OR ALTERNATIVE PORT FUNCTION
MSB
LSB
RESET
VALUE
ACC*
Accumulator
E0H
E7
E6
E5
E4
E3
E2
E1
E0
00H
B*
B register
F0H
F7
F6
F5
F4
F3
F2
F1
F0
00H
DPTR:
DPH
DPL
Data pointer
(2 bytes)
High byte
Low byte
83H
82H
00H
00H
AF
AE
AD
AC
AB
AA
A9
A8
IE*#
Interrupt enable
A8H
EA
EX1
ET0
EX0
00H
82
81
80
P0*#
Port 0
80H
xxxxx111B
97
96
95
94
93
92
91
90
P1*
Port 1
90H
T0
INT1
INT0
FFH
P3*
Port 3
B0H
B7
B6
B5
B4
B3
B2
B1
B0
FFH
PCON#
Power control
87H
PD
IDL
xxxxxx00B
D7
D6
D5
D4
D3
D2
D1
D0
PSW*
Program status word
D0H
CY
AC
F0
RS1
RS0
OV
P
00H
SP
Stack pointer
81H
07H
8F
8E
8D
8C
8B
8A
89
88
TCON*#
Timer/counter control
88H
GATE
C/T
TF
TR
IE0
IT0
IE1
IT1
00H
TL#
Timer low byte
8AH
00H
TH#
Timer high byte
8CH
00H
RTL#
Timer low reload
8BH
00H
RTH#
Timer high reload
8DH
00H
*
SFRs are bit addressable.
#
SFRs are modified from or added to the 80C51 SFRs.
ABSOLUTE MAXIMUM RATINGS
1, 2
PARAMETER
RATING
UNIT
Storage temperature range
–65 to +150
°
C
Voltage from V
CC
to V
SS
–0.5 to +6.5
V
Voltage from any pin to V
SS
(except V
PP
)
–0.5 to V
CC
+ 0.5
V
Power dissipation
1.0
W
Voltage on V
PP
pin to V
SS
0 to +13.0
V
Maximum I
OL
per I/O pin
10
mA
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section
of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
background image
Philips Semiconductors
Product specification
83C750/87C750
80C51 8-bit microcontroller family
1K/64 OTP/ROM, low pin count
1998 May 01
7
DC ELECTRICAL CHARACTERISTICS
T
amb
= 0
°
C to +70
°
C or –40
°
C to +85
°
C, V
CC
= 5V
±
10%, V
SS
= 0V
1
TEST
LIMITS
SYMBOL
PARAMETER
CONDITIONS
MIN
MAX
UNIT
V
IL
Input low voltage
–0.5
0.2V
DD
–0.1
V
V
IH
Input high voltage, except X1, RST
0.2V
CC
+0.9
V
CC
+0.5
V
V
IH1
Input high voltage, X1, RST
0.7V
CC
V
CC
+0.5
V
V
OL
Output low voltage, ports 1 and 3
I
OL
= 1.6mA
2
0.45
V
V
OL1
Output low voltage, port 0
I
OL
= 3.2mA
2
0.45
V
V
OH
Output high voltage, ports 1 and 3
I
OH
= –60
µ
A
2.4
V
I
OH
= –25
µ
A
0.75V
CC
V
I
OH
= –10
µ
A
0.9V
CC
V
C
Capacitance
10
pF
I
IL
Logical 0 input current, ports 1 and 3
V
IN
= 0.45V
–50
µ
A
I
TL
Logical 1 to 0 transition current, ports 1 and 3
3
V
IN
= 2V (0 to +70
°
C)
V
IN
= 2V (–40 to +85
°
C)
–650
–750
µ
A
µ
A
I
LI
Input leakage current, port 0
0.45 < V
IN
< V
CC
±
10
µ
A
R
RST
Internal pull-down resistor
25
175
k
C
IO
Pin capacitance
Test freq = 1MHz,
T
amb
= 25
°
C
10
pF
I
PD
Power-down current
4
V
CC
= 2 to V
CC
max
50
µ
A
V
PP
V
PP
program voltage
V
SS
= 0V
V
CC
= 5V
±
10%
T
amb
= 21
°
C to 27
°
C
12.5
13.0
V
I
PP
Program current
V
PP
= 13.0V
50
mA
I
CC
Supply current (see Figure 3)
5, 6
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless otherwise
noted.
2. Under steady state (non-transient) conditions, I
OL
must be externally limited as follows:
Maximum I
OL
per port pin:
10mA
(NOTE: This is 85
°
C spec.)
Maximum I
OL
per 8-bit port:
26mA
Maximum total I
OL
for all outputs:
67mA
If I
OL
exceeds the test condition, V
OL
may exceed the related specification. Pins are not guaranteed to sink current greater than the listed
test conditions.
3. Pins of ports 1 and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its
maximum value when V
IN
is approximately 2V.
4. Power-down I
CC
is measured with all output pins disconnected; port 0 = V
CC
; X2, X1 n.c.; RST = V
SS
.
5. Active I
CC
is measured with all output pins disconnected; X1 driven with t
CLCH
, t
CHCL
= 5ns, V
IL
= V
SS
+ 0.5V, V
IH
= V
CC
– 0.5V; X2 n.c.;
RST = port 0 = V
CC
. I
CC
will be slightly higher if a crystal oscillator is used.
6. Idle I
CC
is measured with all output pins disconnected; X1 driven with t
CLCH
, t
CHCL
= 5ns, V
IL
= V
SS
+ 0.5V, V
IH
= V
CC
– 0.5V; X2 n.c.;
port 0 = V
CC
; RST = V
SS
.
AC ELECTRICAL CHARACTERISTICS
T
amb
= 0
°
C to +70
°
C or –40
°
C to +85
°
C, V
CC
= 5V
±
10%, V
SS
= 0V
1, 2
VARIABLE CLOCK
SYMBOL
PARAMETER
MIN
MAX
MIN
MAX
UNIT
1/t
CLCL
Oscillator frequency:
3.5
16
3.5
40
MHz
External Clock (Figure 2)
t
CHCX
High time
20
10
ns
t
CLCX
Low time
20
10